Methods and apparatus for discrete mirror processing

Abstract

A method is described for the processing of substrates for utilization as discrete mirrors. The method includes temporarily mounting a first end of at least one substrate onto a grinding machine plate, engaging a second end of the at least one substrate with a grinding wheel, rotating the plate and grinding wheel in opposite directions, and moving the grinding wheel and the plate toward one another at a rate.

1 . A method for processing substrates for utilization as mirrors, said method comprising: 
 temporarily mounting a first end of at least one substrate onto a grinding machine plate;    engaging a second end of the at least one substrate with a grinding wheel;    rotating the plate and grinding wheel in opposite directions throughout processing to polish the substrates; and    moving the grinding wheel and the plate toward one another at a rate.    
   
   
       2 . A method according to  claim 1  further comprising providing a liquid lubricant between the second end of the at least one substrate and the grinding wheel.  
   
   
       3 . A method according to  claim 2  wherein providing a liquid lubricant comprises using a 0.5% coolant and water mixture to remove glass swarf between the grinding wheel and the surface of the at least one substrate.  
   
   
       4 . A method according to  claim 1  wherein rotating the plate and grinding wheel comprises rotating the plate between about thirteen revolutions per minute and about four revolutions per minute.  
   
   
       5 . A method according to  claim 1  wherein rotating the plate and grinding wheel comprises rotating the grinding wheel between about 1000 revolutions per minute and about 1400 revolutions per minute.  
   
   
       6 . A method according to  claim 1  wherein moving the grinding wheel and the plate toward one another at a rate comprises setting a feed rate between about 0.07 millimeters per minute and about 0.015 millimeters per minute.  
   
   
       7 . A method according to  claim 1  further comprising attaching a matrix to the grinding wheel, wherein attaching the matrix comprises selecting at least one of a metal bond matrix and a resin bond matrix.  
   
   
       8 . A method according to  claim 7  wherein selecting at least one of a metal bond matrix and a resin bond matrix comprises selecting a matrix having a particle size between nine and twenty-five microns.  
   
   
       9 . A method according to  claim 1  wherein the at least one substrate includes one or more of a wafer, a rod, and a cube fabricated from glass.  
   
   
       10 . A method according to  claim 1  wherein moving the grinding wheel and the plate toward one another comprises moving the grinding wheel and plate to provide a surface finish for the substrate of between 0.01 micrometer and 0.30 micrometer and sub-surface damage between 2.87 micrometers and 3.05 micrometers.  
   
   
       11 . A process for fabricating a mirror from a substrate comprising: 
 rotating an end of the substrate in a first direction;    configuring a grinding wheel with a matrix having a particle size between 9 and 25 microns;    engaging the end of the substrate with a grinding wheel; and    rotating the grinding wheel in a direction opposite that of the substrate throughout the fabrication of the mirror.    
   
   
       12 . A process according to  claim 11  wherein rotating an end of the substrate in a first direction comprises rotating the substrate between about thirteen revolutions per minute and about four revolutions per minute.  
   
   
       13 . A process according to  claim 11  wherein rotating the grinding wheel comprises rotating the grinding wheel between about 1000 revolutions per minute and about 1400 revolutions per minute.  
   
   
       14 . A process according to  claim 11  further comprising providing a liquid lubricant at the engagement of the substrate and the grinding wheel.  
   
   
       15 . A method according to  claim 14  wherein providing a liquid lubricant comprises using a 0.5% coolant and water mixture to remove glass swarf between the grinding wheel and the surface of the substrate.  
   
   
       16 . A method according to  claim 11  further comprising moving the grinding wheel and the plate toward one another at a feed rate between about 0.07 millimeters per minute and about 0.015 millimeters per minute.  
   
   
       17 . A method according to  claim 11  wherein the substrate includes one or more of a wafer, a glass rod, and a cube.  
   
   
       18 . A method according to  claim 11  further comprising polishing to a resultant surface finish of between 0.01 micrometer and 0.30 micrometer.  
   
   
       19 . A method according to  claim 11  further comprising polishing to a resultant sub-surface damage of between 2.87 micrometers and 3.05 micrometers.  
   
   
       20 . A method according to  claim 11  further comprising polishing the substrate surface to a finish between 1 Angstrom and 3 Angstroms.