Wafer inspection data handling and defect review tool

Abstract

A defect detected by a wafer inspection tool is reliably captured by a defect review tool. A defect review condition in the defect review tool is varied depending on defect attributes provided by the wafer inspection tool so as to optimize the review process. For example, review magnification is varied depending on the size of the defect, or the frame addition number is varied depending on the maximum gray level difference.

1 . A defect data processing method comprising the steps of: 
 acquiring from a wafer inspection tool a plurality of pieces of information about the coordinates and attributes of defects obtained by inspecting a test subject a plurality of times;    identifying information from said plurality of pieces of information that is associated with the same defect based on the coordinates of said defects;    outputting information concerning the coordinates and attributes of a defect to be reviewed to a defect review tool; and    acquiring an image of said defect in said defect review tool using the information about the coordinates and attributes of said defect.    
   
   
       2 . The defect data processing method according to  claim 1 , wherein a review condition of said defect review tool is modified depending on the attributes of said defect that have been outputted.  
   
   
       3 . The defect data processing method according to  claim 1 , wherein the plurality of inspections are performed with varying inspection conditions.  
   
   
       4 . The defect data processing method according to  claim 2 , wherein the attributes of said defect comprise the absolute value of the gray level of a defect portion obtained from a subtract image between an image of the location where said defect has been identified and a reference image thereof.  
   
   
       5 . The defect data processing method according to  claim 2 , wherein the attributes of said defect comprise the size of said defect.  
   
   
       6 . The defect data processing method according to  claim 4 , wherein said review condition comprises the frame addition number upon acquisition of an image of said defect.  
   
   
       7 . The defect data processing method according to  claim 5 , wherein said review condition comprises magnification upon acquisition of an image of said defect.  
   
   
       8 . A defect review tool comprising: 
 an input unit for accepting the entry of information about the coordinates and attributes of a defect;    a sample stage that is movable while carrying a test subject;    an image acquiring unit for acquiring an image of said test subject;    a control unit for controlling said sample stage and said image acquiring unit; and    a table in which a relationship between the attributes of a defect and a review condition is stored,    wherein said control unit moves said sample stage to the coordinates of a defect that are entered on said input unit, determines a review condition by referring to said table, and acquires an image of said defect while setting the thus determined review condition in said image acquiring unit.    
   
   
       9 . The defect review tool according to  claim 8 , wherein said table stores a relationship between the absolute value of the gray level of a defect portion obtained from a subtract image between an image of the location where a defect has been identified and a reference image thereof, and the frame addition number upon acquisition of an image of the defect.  
   
   
       10 . The defect review tool according to  claim 8 , wherein said table stores a relationship between the size of a defect and magnification upon acquisition of a defect image.  
   
   
       11 . A defect review tool comprising: 
 an input unit for accepting the entry of information concerning the coordinates and attributes of a defect from a wafer inspection tool;    a sample stage that is movable while carrying a test subject;    an image acquiring unit for acquiring an image of said test subject;    a control unit for controlling said sample stage and said image acquiring unit;    a table in which a relationship between the attributes of a defect and a review condition is stored; and    a display unit for displaying information about a defect and accepting an entry regarding the selection of a defect to be reviewed,    wherein said control unit accepts the entry of a plurality of pieces of information regarding the coordinates and attributes of a defect from a wafer inspection tool, which information is obtained by inspecting said test subject a plurality of times, identifies information from said plurality of pieces of information that is associated with the same defect based on the coordinates of said defect, and causes the pieces of information concerning the same defect to be displayed on said display unit at once,    and wherein said control unit moves the sample stage to the coordinates of a defect selected on said display unit, determines a review condition by referring to said table based on the attributes of said defect, and acquires an image of said defect while setting the thus determined review condition in said image acquiring unit.    
   
   
       12 . The defect review tool according to  claim 11 , wherein said table stores a relationship between the absolute value of the gray level of a defect portion obtained from a subtract image between an image of the location where the defect has been identified and a reference image thereof, and the frame addition number upon acquisition of a defect image.  
   
   
       13 . The defect review tool according to  claim 11 , wherein said table stores a relationship between the size of a defect and magnification upon acquisition of a defect image.