Envelope for mailing of cards containing an embedded chip

Abstract

A new mailing envelope for use in mailing of a rigid module that is embedded in a plastic or non-plastic substrate.

1 . A mailing envelope for use in mailing a rigid module that is embedded in a plastic or non-plastic substrate which comprises front and rear panels, a pair of side flaps and a top flap, said side flaps being adapted to be secured to the rear panel immediately inwardly of each side edge and a top panel adapted to be secured to the rear panel immediately below the top edge thereof, said envelope having a false bottom thereby providing a reduced area within the envelope for the contents thereof.  
   
   
       2 . A mailing envelope as claimed in  claim 1  wherein said false bottom extends at least two inches upwardly from the bottom edge thereof.  
   
   
       3 . A mailing envelope as claimed in  claim 1  having a length of not less than 9 & ½ inches and a width of not less than 6 & ⅜ inches.  
   
   
       4 . A mailing envelope as claimed in  claim 1  wherein said side flaps and said top flap carry glue strips comprising an ethylene vinyl acetate polymer.  
   
   
       5 . A mailing envelope as claimed in  claim 4  wherein said glue strips further comprise dextrin.  
   
   
       6 . A mailing envelope as claimed in  claim 1  wherein said side flaps and said top flap carry glue strips comprising a blend of polyvinyl acetate and ethylene vinyl acetate polymer resins.  
   
   
       7 . A mailing envelope as claimed in  claim 6  wherein said glue strips further comprise dextrin.  
   
   
       8 . A mailing envelope as claimed in  claim 1  wherein said side flaps have a minimum of one inch width.  
   
   
       9 . A mailing envelope as claimed in  claim 1  which weighs less than one ounce.