Electronic substrate, electronic circuit, and method and device for manufacturing of the same

Abstract

This device for manufacture of an electronic circuit forms a desired circuit pattern P by permeating liquid material ( 10, 40 ) including a material for circuit pattern formation into a permeable electronic substrate ( 100 ). This device for manufacture comprises an ink jet type head ( 20, 50 ) which discharges liquid material ( 10, 40 ) against an electronic substrate ( 100 ), and a shifting device ( 70 ) which relatively shifts the ink jet type head ( 20, 50 ) and the electronic substrate ( 100 ) with respect to one another.

1 . A method for manufacturing a electronic circuit, in which an inductance is formed upon a permeable electronic substrate by permeating a liquid material which includes a conductive material thereinto and solidifying it, the method for manufacturing a electronic circuit comprising: 
 forming a spiral conductive layer on one surface of the permeable electronic substrate by discharging the liquid material onto the one surface in a spiral pattern, the discharging of the liquid material being controlled so that a depth of the spiral conductive layer is confined to a region adjacent the one surface of the permeable electronic substrate;    forming a first conductive layer that spans from the one surface of the permeable electronic substrate to another surface of the permeable electronic substrate by discharging the liquid material onto the center of the spiral conductive layer, the first conductive layer electrically leading a center of the spiral conductive layer to the another surface of the permeable electronic substrate; and    forming a second conductive layer on the another surface of the permeable electronic substrate by discharging the liquid material onto the another surface, the discharging of the liquid material being controlled so that a depth of the second conductive layer is confined to a region adjacent the another surface of the permeable electronic substrate, the second conductive layer being exposed on the another surface and electrically connected to the first conductive layer.    
   
   
       2 . The method of  claim 1  wherein the second conductive layer is formed as a lead out line linearly extending outwardly from the first conductive layer.  
   
   
       3 . The method of  claim 1  wherein the second conductive layer extends further outwardly relative to the another surface of the permeable electronic substrate than the spiral conductive layer extends outwardly relative to the one surface of the permeable electronic substrate.  
   
   
       4 . The method of  claim 1  further comprising a magnetic material disposed between spirals of the spiral conductive layer.  
   
   
       5 . The method of  claim 1  wherein the step of forming the spiral conductive layer further comprises discharging the liquid material from an ink jet head facing the one surface of the permeable electronic substrate.  
   
   
       6 . The method of  claim 1  wherein the step of forming the first conductive layer further comprises discharging the liquid material from an ink jet head facing the one surface of the permeable electronic substrate.  
   
   
       7 . The method of  claim 6  wherein the step of forming the first conductive layer further comprises discharging additional amounts of the liquid material from another ink jet head facing the another surface of the permeable electronic substrate and substantially aligned with the center of the spiral conductive layer.  
   
   
       8 . The method of  claim 1  wherein the step of forming the second conductive layer further comprises discharging the liquid material from an ink jet head facing the another surface of the permeable electronic substrate.  
   
   
       9 . The method of  claim 1  wherein the permeable electronic substrate further comprises one of the group consisting of silica fibers, alumina fibers, and ceramic.