Sealing structure for a white light LED

Abstract

A sealing structure for a white light LED comprises a printed circuit layer located on a base, a cladding layer having a through hole is arranged on the printed circuit layer. A chip is received in the through hole and is electrically connected to the printed circuit layer by a welding wire. The through hole is filled with resin for sealing the chip and the welding wire and the surface of the printed circuit layer. A fluorescent film having well-distributed fluorescent substances is received in the through hole for covering the resin, and then an optical lens is laid over the fluorescent film and the cladding layer. Such structure can provide a white light LED light source with even brightness and luminance.

1 . A sealing structure for a white light light emitting diode (LED) comprising: 
 a base including a printed circuit layer and a substrate, the printed circuit layer being arranged on the substrate, and at least one electrode welding pad arranged on the printed circuit layer;    at least one chip located on a surface of the printed circuit layer;    at least one welding wire for connecting the chip and the electrode welding pad on the printed circuit layer;    resin being located on the printed circuit layer for sealing the at least one chip and the at least one welding wire; and    at least one fluorescent film located on the surface of the resin for covering an area of the resin where the chip is located;    wherein the fluorescent film is a film whose fluorescent substances are evenly distributed.    
   
   
       2 . The sealing structure for a white light light emitting diode (LED) as claimed in  claim 1  further comprising a cladding layer having at least one through hole and being arranged on the printed circuit layer, the chip and the resin are received in the through hole; 
 wherein the fluorescent film is arranged in the through hole of the cladding layer and located on the resin.    
   
   
       3 . The sealing structure for a white light light emitting diode (LED) as claimed in  claim 1  further comprising a layer located on the surface of the fluorescent film.  
   
   
       4 . The sealing structure for a white light light emitting diode (LED) as claimed in  claim 3 , wherein the layer is selected from the group consisted of transparent film, optical lens, and optical component.  
   
   
       5 . The sealing structure for a white light light emitting diode (LED) as claimed in  claim 3 , wherein the layer is larger than the through hole of the cladding layer.