Bond Surface Conditioning System for Improved Bondability

Abstract

Thick film bond surfaces on a support structure, such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit having raised bosses engages with and compresses the bond surfaces, resulting in a flatter, wider bond surface having improved reflectivity. The personality kit is fit within a clamp that can be used as a stand-alone unit or integrated into an existing machine, such as a wire bonder.

1 . A device for conditioning the interconnect surfaces of a support structure, the support structure being configured to receive thereon an integrated circuit chip having bond pads which are to be connected to the interconnect surfaces, the device comprising: 
 a first member; and    a raised feature on a surface of the first member, the raised feature being of a pre-determined shape and location as to engage with the interconnect surfaces of the support structure when the member and the support structure are brought into contact with one another.    
   
   
       2 . The device of  claim 1  comprising a second member which second member supports the support structure when the first member and the support structure are brought into contact with one another.  
   
   
       3 . The device of  claim 1  further comprising a heating element which heating element heats at least one surface of one of the first and second members that contact the support structure.  
   
   
       4 . The device of  claim 1  wherein the raised feature is a single continuous feature.  
   
   
       5 . The device of  claim 1  wherein the raised feature comprises a plurality of features of substantially uniform height, which plurality of features collectively engage with the interconnect surfaces of the support structure.  
   
   
       6 . The device of  claim 1  wherein said second member comprises a raised feature on a surface, the raised feature being of a substantially similar shape as said raised feature on the surface of the first member.  
   
   
       7 . The device of  claim 1  further comprising a cavity within said surface of the first member, the cavity being aligned with the location of an integrated circuit chip located on the support structure.  
   
   
       8 . The device of  claim 1  further comprising a clamp mechanism to forcibly engage the first member with the support structure.  
   
   
       9 . The device of  claim 1  wherein said support structure is a lead frame.  
   
   
       10 . The device of  claim 1  wherein said support structure comprises a substrate having formed thereon a conductive trace.