Variable latch

Abstract

Numerous embodiments of variable latch and a method of formation are disclosed. One or more embodiments of the claimed subject matter may comprise a latch with a plurality of contact points formed thereon, and method of fabrication. The plurality of contact points may allow adequate socketing of microelectronic packages of varying sizes in a socket assembly, without the need to modify the latch when the microelectronic package size varies.

1 . A socketing assembly, comprising: 
 at least one latch, wherein said at least one latch has a plurality of contact points formed thereon; and    a socket coupled to the at least one latch, wherein said socket is configured to, in operation, receive one or more sizes of microelectronic package.    
     
     
         2 . The socketing assembly of  claim 1 , wherein at least one of said at least one latch has two contact points formed thereon.  
     
     
         3 . The socketing assembly of  claim 1 , wherein at least one of said at least one latch is formed from glass-filled plastic.  
     
     
         4 . The socketing assembly of  claim 1 , wherein the socket comprises a universal socket.  
     
     
         5 . The socketing assembly of  claim 1 , wherein the socket comprises a self-captivating socket.  
     
     
         6 . The socketing assembly of  claim 1 , further comprising two latches, wherein said two latches each have two contact points formed thereon.  
     
     
         7 . The socketing assembly of  claim 1 , further including one or more springs coupled to said at least one latch, an actuating arm coupled to said at least one latch, and a lid coupled to said actuating arm.  
     
     
         8 . The socketing assembly of  claim 1 , wherein said socket comprises a burn-in socket.  
     
     
         9 . A method of forming a latch, comprising: 
 forming a body;    forming a tab on the body;    forming a lever arm on the body, wherein the lever arm is formed substantially opposite said tab;    forming a fixed pivot point on the body; and    forming a plurality of contact points on the lever arm, wherein at least one of said plurality of contact points is configured to contact one or more microelectronic devices.    
     
     
         10 . The method of  claim 9 , wherein forming of the latch comprises one or more injection molding processes.  
     
     
         11 . The method of  claim 9 , said method further comprising substantially forming said latch from glass-filled plastic.  
     
     
         12 . The method of  claim 9 , said method further comprising forming said latch to provide socketing force to a microelectronic package.  
     
     
         13 . The method of  claim 9 , said method further comprising forming said latch to have two contact points.  
     
     
         14 . The method of  claim 9 , said method further comprising forming said contact points to socket microelectronic devices of different physical dimensions.  
     
     
         15 . The method of  claim 9 , said method further comprising forming said latch to further include one or more springs coupled to said at least one latch, a actuating arm coupled to at least one latch, and a lid coupled to said actuating arm.  
     
     
         16 . The method of  claim 9 , said method further comprising forming said latch comprise one component of a burn-in socket.  
     
     
         17 . The socketing assembly of  claim 1 , wherein said latch is formed from one or more of plastic, vinyl, polyethylene styrene, and polyetherimide.  
     
     
         18 . The socketing assembly of  claim 1 , wherein said latch is approximately 10 millimeters in length.  
     
     
         19 . The socketing assembly of  claim 1 , wherein said latch is coupled to receive a first force and to apply a substantially vertical second force to a microelectronic package to hold the microelectronic package on the socket with electrical continuity between the microelectronic package and the socket.  
     
     
         20 . A socketing assembly, comprising: 
 a latch arm having a plurality of contact points formed thereon; and    a socket coupled to the latch arm, wherein said socket is configured to, in operation, receive one or more sizes of microelectronic package.    
     
     
         21 . The socketing assembly of  claim 20 , wherein of said latch arm has two contact points formed thereon.  
     
     
         22 . The socketing assembly of  claim 20 , wherein of said latch arm is formed from glass-filled plastic.  
     
     
         23 . The socketing assembly of  claim 20 , wherein the socket comprises a universal socket.  
     
     
         24 . The socketing assembly of  claim 20 , wherein the socket comprises a self-captivating socket.  
     
     
         25 . The socketing assembly of  claim 20 , further comprising two latch arms, wherein each of said two latch arms has two contact points formed thereon.  
     
     
         26 . The socketing assembly of  claim 20 , further comprising one or more springs coupled to said latch arm, an actuating arm coupled to said latch arm, and a lid coupled to said actuating arm.  
     
     
         27 . The socketing assembly of  claim 20 , wherein said socket comprises a burn-in socket.  
     
     
         28 . The socketing assembly of  claim 20 , wherein said latch arm is formed from one or more of plastic, vinyl, polyethylene styrene, and polyetherimide.  
     
     
         29 . The socketing assembly of  claim 20 , wherein said latch arm is approximately 10 millimeters in length.  
     
     
         30 . The socketing assembly of  claim 20 , wherein said latch arm is coupled to receive a first force and to apply a substantially vertical second force to a microelectronic package to hold the microelectronic package on the socket with electrical continuity between the microelectronic package and the socket.