US2007091618A1PendingUtilityA1

High power led electro-optic assembly

47
Individually held — no corporate assignee on recordPriority: Jun 15, 2004Filed: Dec 14, 2006Published: Apr 26, 2007
Est. expiryJun 15, 2024(expired)· nominal 20-yr term from priority
Inventors:Ronald E. Belek
H10W 90/756H10W 72/5524H10W 72/5522B29C 66/1122F21V 29/70F21V 29/51B29C 65/4855B29C 65/4835G02B 19/0028F21V 29/505B29C 66/5344B29C 66/61Y10S362/80F21Y 2115/10B29C 65/4845B29C 65/54G02B 19/0061H10H 20/8586H10H 20/857H10H 20/856H10H 20/855H10H 20/8585F21V 5/041
47
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Claims

Abstract

The present invention provides a high power LED electro-optic assembly ( 40 ) including conductive heat sink ( 18 ) and an LED ( 14 ) mounted at one end of the heat sink. The LED ( 14 ) is in electrical engagement with the heat sink ( 18 ). The assembly ( 40 ) also includes a reflector ( 2 ) mounted at the other end of the heat sink. An insulating bond material ( 19 ) is provided between the reflector and the sink. The assembly ( 40 ) further includes a conductive bonding pin ( 15 ) extending through the reflector ( 12 ) and is in conductive engagement therewith and an electrical engagement ( 16 ) which electrically engages the pin ( 15 ) to the LED ( 14 ). Finally, an electric sleeve assembly ( 30 ) where the sleeve ( 32 ) is coated with an electrical insulating coating ( 34 ) is applied to the LED electro-optic assembly.

Claims

exact text as granted — not AI-modified
1 - 19 . (canceled)  
     
     
         20 . A method of forming a LED electro-optic assembly comprising the steps of; 
 conductively attaching at least one LED to a conductive heat sink.    surrounding said LED with a conductive reflector, said reflector including a bonding pin extending through; and    electrically engaging said bonding pin to said LED.    
     
     
         21 . The method of  claim 20  further including the step of: 
 interposing an insulator between said reflector and said heat sink.    
     
     
         22 . The method of  claim 20  wherein said surrounding step includes: 
 disposing an insulative bonding agent between said reflector and said heat sink.    
     
     
         23 . The method of  claim 20  wherein said wire bonding step includes: 
 interposing a conductive bonding wire between said pin and said LED.    
     
     
         24 . The method of  claim 20  wherein said heat sink is a heat pipe.  
     
     
         25 . A LED electro-optic retaining assembly comprising: 
 a generally cylindrical sleeve having an upper portion and a lower portion, said sleeve coated with an electrical insulator;    at least one passage located at an upper portion for insertion of a bonding agent, wherein said upper portion is modified to retain said electro-optic.    
     
     
         26 . The assembly of  claim 25  wherein said sleeve is constructed from aluminum or an alloy thereof.  
     
     
         27 . The assembly of  claim 25  wherein said bonding agent provides a conductive engagement between the sleeve and a metal contact inside the upper portion.  
     
     
         28 . The assembly of  claim 27  wherein said bonding agent is a conductive adhesive.  
     
     
         29 . The assembly of  claim 27  wherein said bonding agent is a wire.  
     
     
         30 . The assembly of  claim 27  wherein said upper portion includes a first electrode member and press fit reflectivity surface mounted therein.  
     
     
         31 . The assembly of  claim 27  wherein said lower portion includes a second electrode member with electrically conducting heat sink mounted therein.  
     
     
         32 - 40 . (canceled)

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