Mold and imprint apparatus

Abstract

In order to provide a mold and an imprint apparatus which permit adjustment of a depth of an imprint pattern after the imprint pattern is formed, the mold is constituted by a mold substrate including a first material and a surface layer, constituting a projection of the mold and including a second material, for forming a pattern on the photocurable resin material. The first material is more etchable than the second material. The first material and the second material have optical transmittances capable of curing the photocurable resin material with respect to at least a part of wavelength range of ultraviolet light.

1 . A mold for imprinting a pattern on a photocurable resin material, comprising: 
 a mold substrate comprising a first material; and    a surface layer, constituting a projection of said mold and comprising a second material, for forming a pattern on the photocurable resin material;    wherein the first material is more etchable than the second material, and wherein the first material and the second material have optical transmittances capable of curing the photocurable resin material with respect to at least a part of wavelength range of ultraviolet light.    
     
     
         2 . A mold according to  claim 1 , wherein the first material and the second material have a ratio of an etching rate of first material to an etching rate of second material of not less than 10.  
     
     
         3 . A mold according to  claim 1 , wherein the second material has an optical transmittance, to light at a wavelength of 365 nm, of not less than 30%.  
     
     
         4 . A mold according to  claim 1 , wherein said surface layer constitutes a part of the projection of said mold.  
     
     
         5 . A mold according to  claim 1 , wherein said surface layer constitutes all of the projection of said mold.  
     
     
         6 . A mold according to  claim 1 , wherein the first material is silicon oxide and the second material is selected from the group consisting of silicon nitride, titanium oxide, aluminum oxide, calcium fluoride, and indium tin oxide.  
     
     
         7 . An imprint apparatus for effecting imprint by irradiating a photocurable resin material with ultraviolet light through a mold to cure the photocurable resin material, comprising: 
 as the mold, a mold according to  claim 1 .    
     
     
         8 . A process for producing a device, comprising: 
 preparing a mold according to  claim 1;     causing the mold to contact a photocurable resin material; and    irradiating the photocurable resin material with ultraviolet light through the mold.    
     
     
         9 . A mold for imprinting a pattern on a resin material, comprising: 
 a mold substrate comprising a first material; and    a surface layer, constituting a projection of said mold and comprising a second material, for forming a pattern on the photocurable resin material;    wherein the first material is more etchable than the second material, and wherein the first material and the second material have optical transmittances capable of being optically measured.    
     
     
         10 . A mold for imprinting a pattern on a photocurable resin material, comprising: 
 a mold substrate comprising a first material; and    a surface layer, constituting a projection of said mold and comprising a second material, for forming a pattern on the photocurable resin material;    wherein the first material is more etchable than the second material, and wherein the first material and the second material have optical transmittances capable of curing the photocurable resin material.