Integrated circuit package encapsulating a hermetically sealed device

Abstract

An integrated circuit package is disclosed having a semiconductor chip, a hermetically sealed device supported by the semiconductor chip, and a molding compound sealing the semiconductor chip and the device together as a composite package. A method of manufacturing the package is also disclosed.

1 - 32 . (canceled)  
   
   
       33 . An integrated circuit package, comprising: 
 a semiconductor die having a surface, the surface of the semiconductor die having an area;    a housing having a surface, the surface of the housing having an area less than the area of the surface of the semiconductor die, the housing being hermetically sealed;    an attachment portion, the attachment portion being provided between the hermetic housing and the semiconductor die, the attachment portion being configured to attach the housing to the semiconductor die; and    an encapsulant, the encapsulant collectively sealing the semiconductor die, the housing, and the attachment portion.    
   
   
       34 . An integrated circuit package according to  claim 33 , wherein the attachment portion includes an adhesive.  
   
   
       35 . An integrated circuit package according to  claim 33 , wherein the integrated circuit package is a first package, and the attachment portion includes an oscillator circuit, the oscillator circuit being provided in a second package.  
   
   
       36 . An integrated circuit package according to  claim 33 , further comprising an oscillator circuit, the oscillator circuit being provided on the housing.  
   
   
       37 . An integrated circuit package according to  claim 36 , further comprising: 
 a first wiring, the first wiring being configured to electrically couple the oscillator circuit to the semiconductor die;    a second wiring; and    a lead frame, the second wiring being configured to electrically couple the oscillator circuit to the lead frame.    
   
   
       38 . An integrated circuit package according to  claim 33 , wherein the housing includes a resonator.  
   
   
       39 . An integrated circuit package according to  claim 33 , wherein the semiconductor die includes a microprocessor circuit.  
   
   
       40 . An integrated circuit package according to  claim 35 , further including a plurality of solder bumps, wherein the oscillator circuit is coupled to the semiconductor die through the solder bumps.