US2007087216A1PendingUtilityA1

Glass molding die, renewal method thereof, and glass fabrication by the molding die

Assignee: ASIA OPTICAL CO INCPriority: Apr 9, 2004Filed: Dec 20, 2006Published: Apr 19, 2007
Est. expiryApr 9, 2024(expired)· nominal 20-yr term from priority
Inventors:Jui-Fen Pai
Y02P40/57C03B 11/086Y10T428/12493Y10T29/49718Y10T428/12778Y10T428/12771C03B 2215/17C03B 2215/12C03B 2215/32
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Claims

Abstract

A molding die for molding glass and renewal method thereof. The molding die includes a substrate, a nickel-phosphorous alloy layer, with phosphorous content 30 wt % or less, overlying the substrate, an intermediate layer overlying the nickel-phosphorous alloy layer, and a passivation film overlying the intermediate layer.

Claims

exact text as granted — not AI-modified
1 . A glass molding die, comprising: a substrate; a nickel-phosphorous alloy layer, with phosphorous content 30 wt % or less, overlying the substrate; an intermediate layer overlying the nickel-phosphorous alloy layer; and a passivation film overlying the intermediate layer.  
   
   
       2 . The molding die as claimed in  claim 1 , wherein the substrate comprises tungsten carbide.  
   
   
       3 . The molding die as claimed in  claim 1 , wherein the nickel-phosphorous alloy layer further comprises approximately 0.1 to 10 wt % of high melting point metals or alloys thereof.  
   
   
       4 . The molding die as claimed in  claim 1 , wherein the nickel-phosphorous alloy layer is about 20 to 100 μm thick.  
   
   
       5 . The molding die as claimed in  claim 1 , wherein the intermediate layer comprises nickel and combinations of at least two of iridium, rhenium, platinum, ruthenium, rhodium, and osmium.  
   
   
       6 . The molding die as claimed in  claim 1 , wherein the intermediate layer is about 0.1 to 1 μm thick.  
   
   
       7 . The molding die as claimed in  claim 1 , wherein the passivation film comprises combinations of at least two of iridium, rhenium, platinum, ruthenium, rhodium, and osmium.  
   
   
       8 . The molding die as claimed in  claim 1 , wherein the passivation film is about 0.02 to 0.3 μm thick.

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