Method and System for Integrated Circuit Packaging

Abstract

According to one embodiment of the invention, a system for packaging integrated circuits includes a mold tool for packaging integrated circuits. The mold tool includes a first mold plate that includes a first non-planar surface and a second mold plate that includes a second non-planar surface. The first and second non-planar surfaces form upper and lower surfaces of a mold cavity when the first and second mold plates are engaged. The mold tool also includes a distribution system coupled to the mold cavity. The distribution system transfers a mold compound into the mold cavity to substantially encapsulate an integrated circuit. The distribution system includes a gate runner coupled to the mold cavity. The gate runner funnels the mold compound into the mold cavity. The distribution system also includes a bridge insert that decreases wear on the gate runner as the mold compound is transferred through the gate runner.

1 . A mold tool for packaging integrated circuits, comprising: 
 a first mold plate comprising a first non-planar surface;    a second mold plate comprising a second non-planar surface, the first and second non-planar surfaces forming upper and lower surfaces of a mold cavity when the first and second mold plates are engaged; and    a distribution system coupled to the mold cavity, the distribution system operable to transfer a mold compound into the mold cavity to substantially encapsulate an integrated circuit, the distribution system comprising: 
 a gate runner coupled to the mold cavity, the gate runner operable to funnel the mold compound into the mold cavity; and  
 a bridge insert operable to decrease wear on the gate runner as the mold compound is transferred through the gate runner.  
   
   
   
       2 . The mold tool of  claim 1 , wherein the distribution system further comprises a transfer system coupled to the gate runner, the transfer system comprising: 
 a mold source for storing mold compound in the distribution system; and    a plunger operable to apply a compressive load to the mold compound in the mold source to transfer the mold compound from the mold source to the gate runner.    
   
   
       3 . The mold tool of  claim 2 , wherein the distribution system further comprises one or more passages coupling the mold source to the gate runner.  
   
   
       4 . The mold tool of  claim 1 , wherein the gate runner includes first and second ends, the cross-sectional area of the second end is less than the cross-sectional area of the first end, the second end operable to funnel mold compound into the mold cavity.  
   
   
       5 . The mold tool of  claim 4 , wherein the bridge insert is of a shape and size corresponding to the second end of the gate runner, the bridge insert adjacent to an inner wall of the gate runner.  
   
   
       6 . The mold tool of  claim 1 , wherein the bridge insert comprises a ceramic bridge insert, the ceramic bridge insert including a metal oxide composite.  
   
   
       7 . The mold tool of  claim 1 , wherein the bridge insert comprises a ceramic bridge insert, the ceramic bridge insert including a metal nitride composite.  
   
   
       8 . The mold tool of  claim 1 , wherein the bridge insert comprises a ceramic bridge insert, the ceramic bridge insert including a silicon nitride doped with titanium nitride.  
   
   
       9 . The mold tool of  claim 1 , wherein the bridge insert comprises a high strength metal composite adapted to increase the lifespan of the mold tool to approximately 1 kk mold cycles.  
   
   
       10 . The mold tool of  claim 1 , wherein the mold compound comprises an epoxy resin of a temperature on the order of 170 to 175° C.