Heat sink device with shielding member

Abstract

A heat sink device includes a heat sink ( 20 ) and a shielding member ( 30 ). The heat sink defines a receiving groove ( 220 ). The shielding member includes a fixing plate ( 322 ) received in the receiving groove, and a receiving portion ( 300 ) for receiving an electronic component. The heat sink device not only protects the electronic component from EMI, but also effectively dissipates heat generated by the electronic component.

1 . A heat sink device comprising: 
 a heat sink defining a receiving groove; and    a shielding member comprising a fixing plate received in the receiving groove, and a receiving portion for receiving an electronic component.    
   
   
       2 . The heat sink device as claimed in  claim 1 , wherein the shielding member defines an opening.  
   
   
       3 . The heat sink device as claimed in  claim 2 , wherein the number of the fixing plate is two, the fixing plates respectively formed at opposite sides of the opening.  
   
   
       4 . The heat sink device as claimed in  claim 3 , wherein the shielding member comprises a top wall, and a plurality of sidewalls each perpendicular to the top wall, the top wall and the sidewalls surrounding the receiving portion, the opening defined in the top wall.  
   
   
       5 . The heat sink device as claimed in  claim 1 , wherein the heat sink comprises a base, and a plurality of heat dissipating protuberances perpendicular to the base.  
   
   
       6 . The heat sink device as claimed in  claim 5 , wherein the number of the receiving groove is two, the receiving grooves respectively defined in opposite sides of the base.  
   
   
       7 . The heat sink device as claimed in  claim 1 , further comprising a heat conducting film coupled to the heat sink.  
   
   
       8 . The heat sink device as claimed in  claim 7 , wherein the heat conducting film is made of silicon rubber.  
   
   
       9 . An electronic device assembly comprising: 
 a circuit board comprising an electronic component;    a heat sink for dissipating heat generated by the electronic component, the heat sink comprising a receiving groove; and    a shielding member mounted on the circuit board, the shielding member comprising a fixing plate received in the receiving groove, and a receiving portion for receiving the electrical component.    
   
   
       10 . The electronic device assembly as claimed in  claim 9 , wherein the shielding member defines an opening.  
   
   
       11 . The electronic device assembly as claimed in  claim 10 , wherein the number of the fixing plate is two, the fixing plates respectively formed at opposite sides of the opening.  
   
   
       12 . The electronic device assembly as claimed in  claim 11 , wherein the shielding member comprises a top wall, and a plurality of sidewalls each perpendicular to the top wall, the top wall and the sidewalls surrounding the receiving portion, the opening defined in the top wall.  
   
   
       13 . The electronic device assembly as claimed in  claim 9 , wherein the heat sink comprises a base, and a plurality of heat dissipating protuberances perpendicular to the base.  
   
   
       14 . The electronic device assembly as claimed in  claim 13 , wherein the number of the receiving groove is two, the receiving grooves respectively defined in opposite sides of the base.  
   
   
       15 . The electronic device assembly as claimed in  claim 9 , further comprising a heat conducting film coupled to the heat sink.  
   
   
       16 . The electronic device assembly as claimed in  claim 15 , wherein the heat conducting film is made of silicon rubber.