US2007084829A1PendingUtilityA1

System for processing a workpiece

Assignee: SEMITOOL INCPriority: Jan 22, 1999Filed: May 18, 2006Published: Apr 19, 2007
Est. expiryJan 22, 2019(expired)· nominal 20-yr term from priority
Inventors:Kyle M. Hanson
H10P 72/7624H10P 72/0462H10P 72/0456H10P 72/0406H10P 72/0402H10P 50/667H10P 72/0448
50
PatentIndex Score
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Claims

Abstract

A system for processing a workpiece includes a process head assembly and a base assembly. The process head assembly has a process head and an upper rotor. The base assembly has a base and a lower rotor. The base and lower rotor have magnets wherein the upper rotor is engageable with the lower rotor via a magnetic force created by the magnets. The engaged upper and lower rotors form a process chamber where a semiconductor wafer is positioned for processing. Process fluids for treating the workpiece are introduced into the process chamber, optionally while the processing head spins the workpiece. Additionally, air flow around and through the process chamber is managed to reduce particle adders on the workpiece.

Claims

exact text as granted — not AI-modified
1 . A method for processing a workpiece comprising the steps of: 
 placing the workpiece into a base assembly having a base and a first rotor;    applying a magnetic force to repel the first rotor from the base;    engaging a second rotor to the first rotor to form a process chamber around the workpiece;    forcing the engaged rotors against the magnetic repulsion force to create engagement between the first and second rotors;    spinning the first and second rotors; and    applying a processing fluid to the workpiece.    
   
   
       2 . The method of  claim 1 , wherein the step of applying a process fluid to the workpiece comprises the steps of: 
 applying a first processing fluid to a first surface of the workpiece; and    applying a second processing fluid to a second surface of the workpiece.    
   
   
       3 . The method of  claim 1  further comprising the step of draining the process fluid from the process chamber.  
   
   
       4 . The method of  claim 2 , wherein the first process fluid comprises a fluid selected from the group consisting of air, nitrogen, isopropylalcohol, water, ozonated water, hydrofluoric acid, sulfuric acid, hydrogen peroxide, and ST-250.  
   
   
       5 . The method of  claim 2 , wherein the second process fluid comprises a fluid selected from the group consisting of air, water, ozonated water, nitrogen, isopropylalcohol, hydrofluoric acid, sulfuric acid, hydrogen peroxide, and ST-250.  
   
   
       6 . A method for processing a workpiece comprising the steps of: 
 placing the workpiece into a process vessel having an upper rotor and a lower rotor;    applying a magnetic force to one of either the upper or lower rotors so that the upper rotor engages the lower rotor to form a process chamber around the workpiece;    spinning the engaged first and second rotors and the workpiece; and    applying a process fluid to the workpiece.    
   
   
       7 . The method of  claim 6 , wherein the upper and lower rotors comprise a plurality of pins for containing the workpiece.  
   
   
       8 . The method of  claim 6  further comprising the step of venting gaseous fluids from the process chamber.  
   
   
       9 . The method of  claim 8 , wherein the step of venting gaseous fluids from the process chamber comprises applying a vacuum to the process chamber.  
   
   
       10 . The method of  claim 6  further comprising the step of draining the process fluid from the process chamber.  
   
   
       11 . The method of  claim 6  further comprising the step of aligning the workpiece in an x-y plane before applying a magnetic force to one of either the upper or lower rotors.  
   
   
       12 . The method of  claim 6  further comprising the step of drawing air into the process chamber  
   
   
       13 . The method of  claim 6 , wherein the workpiece has a top side and a backside and the step of applying a process fluid to the workpiece comprises: 
 applying a first process fluid to the top side of the workpiece; and    applying a second process fluid to the backside of the workpiece.    
   
   
       14 . The method of  claim 13 , wherein the first and second process fluids comprises a fluid selected from the group consisting of air, nitrogen, isopropylalcohol, water, ozonated water, hydrofluoric acid, sulfuric acid, hydrogen peroxide and ST-250.  
   
   
       15 . A method for processing a plurality of workpieces comprising the steps of: 
 providing a plurality of workpieces at an input/output station;    moving the plurality of workpieces from the input/output station to a plurality of process stations, at least one of the plurality of process stations having a workpiece processor comprising a process head assembly having a process head and an upper rotor, a base assembly having a base and a lower rotor, the base having a first magnet and the lower rotor having a second magnet; 
 placing the plurality of workpieces into the at least one workpiece processor a single workpiece at a time;  
 applying a magnetic force to repel the lower rotor from the base such that the lower rotor engages the upper rotor with the single workpiece positioned between the lower and upper rotors;  
 spinning the rotors and the single workpiece;  
 applying a process fluid to the single workpiece;  
 removing the single workpiece from the at least one process station; and  
   returning the processed workpieces to the input/output station.    
   
   
       16 . The method of  claim 15 , wherein a process is carried out on the workpieces at each of the plurality of process stations and the process is one selected from a group consisting of electrochemical processing, etching, rinsing and drying.  
   
   
       17 . The method of  claim 15 , wherein a robot moves the plurality of workpieces from the input/output station to the plurality of process stations.  
   
   
       18 . The method of  claim 15 , wherein the step of applying a process fluid to the single workpiece comprises: 
 applying a first process fluid to a first surface of the single workpiece; and    applying a second process fluid to a second surface of the single workpiece.    
   
   
       19 . The method of  claim 18 , wherein the first process fluid is different than the second process fluid.  
   
   
       20 . The method of  claim 15 , wherein the step of applying a process fluid to the single workpiece comprises: 
 applying a chemical etchant to the single workpiece;    rinsing the single workpiece with deionized water; and    drying the single workpiece with heated nitrogen.

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