Poly (alkylene oxide) polymer-based pressure sensitive adhesive and tapes formed therefrom

Abstract

A pressure sensitive adhesive is provided which is comprised of at least one radiation cured oligomer and/or monomer which is cured in situ on a substrate in the form of a coating. The adhesive comprises an insoluble polymer which comprises a plurality of polyether segments comprising —C a H 2a O— repeat units, wherein a is an integer of 1 to 4, with the segments comprising from about 20 to about 85 percent by weight of polymer.

1 . A pressure sensitive adhesive comprised of at least one radiation-cured oligomer and/or monomer, said radiation-cured oligomer and/or monomer comprising an insoluble polymer which comprises a plurality of polyether segments comprising —C a H 2a O— repeat units, wherein a is an integer of 1 to 4, said segments comprising from about 20 to about 85 percent by weight of said polymer.  
   
   
       2 . A pressure sensitive adhesive of  claim 1 , wherein said polyether segments are selected from the group consisting of —CH 2 O—, —CH 2 CH 2 O—, —CH 2 (CH 3 )CHO—, —CH 2 CH 2 CH 2 CH 2 O—, —CH 2 (C 2 H 5 )CHO—, and mixtures thereof.  
   
   
       3 . A pressure sensitive adhesive of  claim 1 , wherein said polyether segments comprise from 35 to 85 percent by weight of said polymer.  
   
   
       4 . A pressure sensitive adhesive of  claim 1 , comprising from about 15% to about 65% by weight of an epoxy containing compound.  
   
   
       5 . A pressure sensitive adhesive of  claim 1  comprising up to about 50% by weight of an acrylate-containing compound.  
   
   
       6 . A pressure sensitive adhesive of  claim 1  comprising from about 15% to about 45% by weight of tackifier.  
   
   
       7 . A pressure sensitive adhesive of  claim 6  comprising from about 15% to about 35% by weight of tackifier.  
   
   
       8 . A pressure sensitive adhesive of  claim 1  comprising from about 15% to about 45% by weight of a plasticizer.  
   
   
       9 . A pressure sensitive adhesive of  claim 8  comprising from about 15% to about 35% by weight of a plasticizer.  
   
   
       10 . A pressure sensitive adhesive of  claim 1  comprising from about 0.1% to about 3% by weight of an initiator.  
   
   
       11 . A pressure sensitive adhesive of  claim 4  wherein said epoxy containing compound is selected from the group consisting of aliphatic epoxides, cycloaliphatic epoxides, and epoxidized vinyl compounds.  
   
   
       12 . A pressure sensitive adhesive of  claim 6  wherein said tackifier is selected from the group consisting of terpene phenolics, alpha methyl styrene derived resins, rosin derived tackifiers, monomeric alcohols, oligomeric alcohols, and oligomeric glycols.  
   
   
       13 . A pressure sensitive adhesive of  claim 8  wherein said plasticizer is selected from the group consisting of terpene phenolics, rosin-derived plasticizers, and polyglycols.  
   
   
       14 . A pressure sensitive adhesive of  claim 10  wherein said initiator comprises an onium salt cationic photoinitiator.  
   
   
       15 . A pressure sensitive adhesive of  claim 10  wherein said initiator comprises a free radical photoinitiator.  
   
   
       16 . A pressure sensitive adhesive of  claim 1  wherein said oligomer or monomer is represented by one or more of the formulae  
     
       
         
         
             
             
         
       
     
     wherein X 1 , X 2 , X 3  are terminal groups at least one of which permits a curing reaction and wherein X 1 , X 2 , X 3  may be the same or different from each other; n, m and p may range from 2 to 1000, R is a straight or branched alkylene group having the formula (CR 1 R 2 ) q  where q is an integer from 1 to 4, and R 1  and R 2  may independently be hydrogen and C 1-3  alkyl.  
   
   
       17 . A pressure sensitive adhesive tape comprised of the adhesive of  claim 1  on a backing material.  
   
   
       18 . A pressure sensitive adhesive tape of  claim 17  where a second side of the backing material is coated with a pressure sensitive adhesive.  
   
   
       19 . A removable pressure sensitive adhesive tape comprised of the adhesive composition of  claim 1  used in the assembly of touch screens to liquid crystal display screens.  
   
   
       20 . A pressure sensitive adhesive tape comprised of the composition of  claim 1  used in the assembly and mounting of removable graphics on a rigid or flexible substrate.  
   
   
       21 . A removable pressure sensitive adhesive tape comprised of the composition of  claim 1  used in the assembly and mounting of rigid or flexible display screens.  
   
   
       22 . A removable pressure sensitive adhesive tape comprised of the composition of  claim 1  used as a protective covering for various components during further processing procedures.  
   
   
       23 . A pressure sensitive adhesive of  claim 1  used in the bonding of transparent labels to glass or plastic surfaces.  
   
   
       24 . A pressure sensitive adhesive of  claim 1  used in the sealing of biological test plates.  
   
   
       25 . A method of forming a pressure sensitive adhesive tape, comprising providing at least one radiation-curable oligomer and/or monomer on a substrate, said oligomer or monomer comprising a plurality of polyether segments comprising —C a H 2a O— repeat units, wherein a is an integer of 1 to 4, and radiation-curing said oligomer and/or monomer in situ on said substrate, wherein said segments comprise from about 20 to about 85 percent by weight of said resulting polymer, and exposing said radiation-curable oligomer and/or monomer to radiation to form said radiation-cured pressure sensitive adhesive tape.  
   
   
       26 . A method of  claim 25 , wherein said polyether segments are selected from the group consisting of —CH 2 O—, —CH 2 CH 2 O—, —CH 2 (CH 3 )CHO—, —CH 2 CH 2 CH 2 CH 2 O—, —CH 2 (C 2 H 5 )CHO—, and mixtures thereof.  
   
   
       27 . A method of  claim 25 , wherein said polyether segments comprise from 35 to 85 percent by weight of said polymer.  
   
   
       28 . A method of  claim 25 , comprising from about 15% to about 65% by weight of an epoxy containing compound.  
   
   
       29 . A method of  claim 25 , comprising up to about 50% by weight of an acrylate containing compound.  
   
   
       30 . A method of  claim 25 , comprising from about 15% to about 45% by weight of tackifier.  
   
   
       31 . A method of  claim 30 , comprising from about 15% to about 35% by weight of tackifier.  
   
   
       32 . A method of  claim 25 , comprising from about 15% to about 45% by weight of a plasticizer.  
   
   
       33 . A method of  claim 32 , comprising from about 15% to about 35% by weight of a plasticizer.  
   
   
       34 . A method of  claim 25 , comprising from about 0.1% to about 3% by weight of an initiator.  
   
   
       35 . A method of  claim 28 , wherein said epoxy-containing compound is selected from the group consisting of aliphatic epoxides, cycloaliphatic epoxides, and epoxidized vinyl compounds.  
   
   
       36 . A method of  claim 30 , wherein said tackifying compound is selected from the group consisting of terpene phenolics, alpha methyl styrene derived resins, rosin derived tackifiers, monomeric alcohols, oligomeric alcohols, and oligomeric glycols.  
   
   
       37 . A method of  claim 32 , wherein said plasticizer is selected from the group consisting of terpene phenolics, rosin-derived plasticizers, and polyglycols.  
   
   
       38 . A method of  claim 34 , wherein said initiator comprises an onium salt cationic photoinitiator.  
   
   
       39 . A method of  claim 34 , wherein said initiator comprises a free radical photoinitiator.  
   
   
       40 . A method of  claim 25 , wherein said radiation-curable oligomer or monomer is represented by one or more of the formulae  
     
       
         
         
             
             
         
       
     
     wherein X 1 , X 2 , X 3  are terminal groups at least one of which permits a curing reaction and wherein X 1 , X 2 , X 3  may be the same or different from each other; n, m and p may range from 2 to 1000, R is a straight or branched alkylene group having the formula (CR 1 R 2 ) q  where q is an integer from 1 to 4, and R 1  and R 2  may independently be hydrogen and C 1-3  alkyl.  
   
   
       41 . A light guide comprised of the adhesive of  claim 1.