Relay board and semiconductor device having the relay board

Abstract

A relay board provided in a semiconductor device includes a first terminal, and a plurality of second terminals connecting to the first terminal by a wiring. The wiring connecting to the first terminal is split on the way so that the wiring connects to each of the second terminals.

1 . A relay board provided in a semiconductor device, comprising: 
 a first terminal; and    a plurality of second terminals connecting to the first terminal by a wiring;    wherein the wiring connecting to the first terminal is split on the way so that the wiring connects to each of the second terminals.    
     
     
         2 . A relay board provided in a semiconductor device, comprising: 
 a first terminal; and    a second terminal;    wherein a connection part is formed by at least one of an end part of a first terminal wire connected to the first terminal and an end part of a second terminal wire connected to the second terminal; and    the first terminal and the second terminal are connected by forming a connection member at the connection part.    
     
     
         3 . The relay board as claimed in  claim 2 , 
 wherein the connection member connects the connection part and one of the first terminal and the second terminal.    
     
     
         4 . The relay board as claimed in  claim 2 , 
 wherein a connection wire is formed between the end part of the first terminal wire and the end part of the second terminal wire; and    the first terminal and the second terminal are connected by forming the connection member between one end part of the connection wire and the end part of the first terminal wire and between another end part of the connection wire and the end part of the second terminal wire.    
     
     
         5 . The relay board as claimed in  claim 2 , 
 wherein the connection part is formed by the end part of the first terminal wire and the end part of the second terminal wire; and    the connection member includes a stud bump.    
     
     
         6 . The relay board as claimed in  claim 5 , 
 wherein the stud bump includes first through third stud bumps;    the first stud bump is formed at the end part of the first terminal wire;    the second stud bump is formed at the end part of the second terminal wire; and    the third stud bump is stuck onto the first stud bump and the second stud bump so as to be bonded.    
     
     
         7 . The relay board as claimed in  claim 2 , 
 wherein the connection part is formed by the end part of the first terminal wire and the end part of the second terminal wire; and    the connection member includes conductive resin.    
     
     
         8 . The relay board as claimed in  claim 2 , 
 wherein the connection member includes a bonding wire.    
     
     
         9 . The relay board as claimed in  claim 8 , 
 wherein a stud bump is formed on the first terminal or the second terminal;    an end part of the bonding wire is formed on the stud bump; and    another bonding wire configured to connect the first terminal or the second terminal to another structural element of the semiconductor device is formed on the end part of the bonding wire.    
     
     
         10 . The relay board as claimed in  claim 1 , 
 wherein the relay board is made of material the same as the material of a semiconductor element formed in the semiconductor device where the relay board is formed.    
     
     
         11 . The relay board as claimed in  claim 2 , 
 wherein an insulation film is formed on the first terminal wire or the second terminal wire;    a part of the insulation film is opened so that an opening part is formed; and    a metal plating layer is formed in the opening part so as to be situated higher than the insulation film.    
     
     
         12 . A semiconductor device, comprising: 
 at least a single semiconductor element; and    a wiring board or a lead frame;    wherein the semiconductor element and the wiring board or the lead frame are connected by a relay board;    the relay board includes a first terminal and a second terminal;    a connection part is formed by at least one of an end part of a first terminal wire connected to the first terminal and an end part of a second terminal wire connected to the second terminal; and    the first terminal and the second terminal are connected by forming a connection member at the connection part.    
     
     
         13 . The semiconductor device as claimed in  claim 12 , 
 wherein the connection member connects the connection part and one of the first terminal and the second terminal.    
     
     
         14 . The semiconductor device as claimed in  claim 12 , 
 wherein a connection wire is formed between the end part of the first terminal wire and the end part of the second terminal wire; and    the first terminal and the second terminal are connected by forming the connection member between one end part of the connection wire and the end part of the first terminal wire and between another end part of the connection wire and the end part of the second terminal wire.    
     
     
         15 . The semiconductor device as claimed in  claim 12 , 
 wherein the connection part is formed by the end part of the first terminal wire and the end part of the second terminal wire; and    the connection member includes a stud bump.    
     
     
         16 . The semiconductor device as claimed in  claim 15 , 
 wherein the stud bump includes first through third stud bumps;    the first stud bump is formed at the end part of the first terminal wire;    the second stud bump is formed at the end part of the second terminal wire; and    the third stud bump is stuck onto the first stud bump and the second stud bump so as to be bonded.    
     
     
         17 . The semiconductor device as claimed in  claim 12 , 
 wherein the connection part is formed by the end part of the first terminal wire and the end part of the second terminal wire; and    the connection member includes conductive resin.    
     
     
         18 . The semiconductor device as claimed in  claim 12 , 
 wherein the connection member includes a bonding wire.    
     
     
         19 . The semiconductor device as claimed in  claim 18 , 
 wherein a stud bump is formed on the first terminal or the second terminal;    an end part of the bonding wire is formed on the stud bump; and    another bonding wire configured to connect the first terminal or the second terminal to the wiring board or the lead frame is formed on the bonding wire.    
     
     
         20 . The semiconductor device as claimed in  claim 12 , 
 wherein the number of the first terminal and the number of the second terminal are plural respectively;    an arrangement direction of the first terminals is substantially in parallel with an arrangement direction of the second terminals; and    the arrangement order of the first terminals is different from the arrangement order of the second terminals corresponding to the first terminals.