Electronic device and manufacturing method of the same

Abstract

A semiconductor chip of the present invention has a wiring substrate and a chip part. The wiring substrate has an insulating resin layer having a first major surface and a second major surface, and a first wiring layer disposed on the insulating resin layer on the second major surface side. The chip part has a projection electrode on the bottom surface. The insulating resin layer holds the chip part such that the bottom and side surfaces of the chip part are in contact with the insulating resin layer, and the top surface of the chip part is exposed on the insulating layer on the first major surface side. The projection electrode of the chip part is connected with the first wiring layer.

1 - 16 . (canceled)  
     
     
         17 . An electronic device comprising: 
 a wiring substrate including an insulating resin layer having a first major surface and a second major surface and a first wiring layer disposed on said insulating resin layer on the second major surface side;    a second wiring layer formed on the first major surface of said insulating resin layer;    a chip part including a projection electrode on a bottom surface and mounted on said wiring substrate; and    wherein said insulating resin layer holds said chip part such that a bottom and at least a part of side surfaces of said chip part are in contact with said insulating resin layer, and a top surface of said chip part is exposed on said insulating resin layer on the first major surface side, and wherein the projection electrode of the chip part is connected with said first wiring layer.    
     
     
         18 . The electronic device according to  claim 17 , wherein said chip part protrudes from the first main major surface of said insulating resin layer.  
     
     
         19 . The electronic device according to  claim 17 , wherein a ground pattern is formed in said second wiring layer.  
     
     
         20 . The electronic device according to  claim 17 , further comprising a plurality of insulating resin layers for holding the chip part.  
     
     
         21 . The electronic device according to  claim 20 , wherein the insulating resin layers for holding the chip part are laminated such that the first major surfaces are faced in the same direction.  
     
     
         22 . The electronic device according to  claim 17 , wherein said insulating resin layers for holding said chip part are arranged on both surfaces of said wiring substrate.  
     
     
         23 . An electronic device comprising: 
 a wiring substrate including a plurality of insulating resin layers that are laminated and have first major surfaces and second major surfaces and a first wiring layer disposed on said insulating resin layer on the second major surface side from a lowermost layer to an innermost layer in said resin insulating layers;    a second wiring layer formed on the first major surface of said insulating resin layer;    a chip part including a projection electrode on a bottom surface and mounted on said wiring substrate; and    wherein said insulating resin layer holds said chip part such that a bottom and side surfaces of said chip part are in contact with said insulating resin layer in a outmost layer, and a top surface of said chip part is exposed on said insulating resin layer on the second major surface side, and wherein the projection electrode of the chip part is connected with said first wiring layer.    
     
     
         24 . The electronic device according to  claim 17 , wherein said wiring substrate further comprises an insulating layer except for said insulating resin layer and further comprises a wiring layer except for said first wiring layer or first and second wiring layers.  
     
     
         25 . The electronic device according to  claim 17 , wherein a portion exposed from the insulating resin layer of the chip part that enters the insulating resin layer of the outmost layer in the wiring substrate, is covered by a coating resin.  
     
     
         26 . The electronic device according to  claim 17 , wherein the projection electrode of said chip part is provided with a portion having a sharp tip.  
     
     
         27 . The electronic device according to  claim 17 , wherein the projection electrode of said chip part is a gold electrode formed by a wire bonding technique.  
     
     
         28 . The electronic device according to  claim 17 , wherein said insulating resin layer is made of thermoplastic resin or materials in which thermosetting resin is added to thermoplastic resin.  
     
     
         29 . A method of manufacturing an electronic device, comprising the steps of: 
 preparing a wiring substrate having an insulating resin layer having a first major surface and a second major surface, a first wiring layer disposed on said insulating resin layer on the second major surface side and a second wiring layer disposed on said insulating resin layer on the first major surface side, and a chip part including a projection electrode;    pushing the chip part into the insulating resin layer from the first major surface; and    passing the projection electrode of the chip part through the insulating resin layer to be connected with the first wiring layer and sealing at least a surface on which the projection electrode of the chip part is formed with resin of the insulating resin layer.    
     
     
         30 . The method according to  claim 29 , wherein the step of pushing said chip part comprises pushing said chip part while heat is applied.  
     
     
         31 . The method according to  claim 29 , wherein the step of pushing said chip part comprises pushing said chip part while ultrasonic vibration is applied to said chip part or to said wiring substrate.  
     
     
         32 . The method according to  claim 29 , further comprising a step of applying a plasma process or ultraviolet ray irradiation to at least a portion that is to be pushed by said chip part on to the first major surface of said insulating resin layer before the step of pushing said chip part.  
     
     
         33 . The electronic device according to  claim 23 , wherein said wiring substrate further comprises an insulating layer except for said insulating resin layer and further comprises a wiring layer except for said first wiring layer or first and second wiring layers.  
     
     
         34 . The electronic device according to  claim 23 , wherein a portion exposed from the insulating resin layer of the chip part that enters the insulating resin layer of the outmost layer in the wiring substrate, is covered by a coating resin.  
     
     
         35 . The electronic device according to  claim 23 , wherein the projection electrode of said chip part is provided with a portion having a sharp tip.  
     
     
         36 . The electronic device according to  claim 23 , wherein the projection electrode of said chip part is a gold electrode formed by a wire bonding technique.  
     
     
         37 . The electronic device according to  claim 23 , wherein said insulating resin layer is made of thermoplastic resin or materials in which thermosetting resin is added to thermoplastic resin.