US2007075324A1PendingUtilityA1

Optical device

Assignee: MATSUSHITA ELECTRIC INDUSTRIAL CO LTDPriority: Nov 22, 2004Filed: Dec 5, 2006Published: Apr 5, 2007
Est. expiryNov 22, 2024(expired)· nominal 20-yr term from priority
H10W 72/9415H10W 72/07251H10W 72/923H10W 72/90H10W 72/20H10W 76/10H10H 20/8506H10H 20/855H10F 71/00H10F 39/804H10F 39/011H10F 77/50H10F 99/00
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Claims

Abstract

An optical device according to the present invention includes a device substrate, a translucent member, an optical element chip and a conductive portion. On a surface of the device substrate, an opening is provided so as to extend substantially in the vertical direction with respect to a surface of the device substrate and pass through the device substrate, the translucent member is provided so as to cover a first opening mouth of the opening, and the optical element chip is provided so as to cover the other opening mouth thereof. Part of the conductive portion is buried in the device substrate. The outline of the first opening mouth has a point-asymmetrical shape with respect to an approximate center point of the first opening mouth.

Claims

exact text as granted — not AI-modified
1 - 4 . (canceled)  
   
   
       5 . An optical device comprising: 
 a device substrate including an opening formed so as to extend substantially in the vertical direction with respect to a surface of the device substrate and pass through the device substrate;    a translucent member provided so as to cover a first opening mouth of the opening;    an optical element chip provided so as to cover a second opening mouth of the opening and including an optical element formation surface in which an optical element for emitting or receiving light is formed;    a conductive portion provided so as to have part buried in the device substrate and including first terminal portions each of which is electrically connected to the optical element and second terminal portions each of which is electrically connected to a wiring board; and    an encapsulant for encapsulating an electrical connection portion of the optical element and each of the first terminal portions,    wherein the optical element formation surface faces the translucent member, and    wherein an orientation-indicating marker for indicating a position orientation of the second terminal portions in the device substrate is formed in a surface of the optical element chip located in an opposite side to the optical element formation surface.    
   
   
       6 . The optical device of  claim 5 , wherein the orientation-indicating marker is formed of at least a character or a symbol.  
   
   
       7 . An optical device comprising: 
 a device substrate including an opening formed so as to extend substantially in the vertical direction with respect to a surface of the device substrate and pass through the device substrate;    a translucent member provided so as to cover a first opening mouth of the opening;    an optical element chip provided so as to cover a second opening mouth of the opening and including an optical element for emitting or receiving light in a surface of the optical element chip facing the translucent member;    a conductive portion provided so as to have part buried in the device substrate and including first terminal portions each of which is electrically connected to the optical element and second terminal portions each of which is electrically connected to a wiring board; and    an encapsulant for encapsulating an electrical connection portion of the optical element and each of the first terminal portions,    wherein an orientation-indicating through hole for indicating a position orientation of the second terminal portions in the device substrate is formed.

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