Carrier tape and heat shrinking cover tape for integrated circuit devices

Abstract

Disclosed are embodiments of a carrier medium for integrated circuit die (or other components). The carrier medium may include a carrier tape and a heat shrinkable cover tape, the carrier tape including a number of spaced-apart die retaining areas along the length of this tape. Other embodiments are described and claimed.

1 . A carrier medium, comprising: 
 a carrier tape, the carrier tape including a number of retaining areas, each retaining area sized to receive a component; and    a cover tape overlying the retaining areas and secured to the cover tape, wherein the cover tape comprises a heat shrinkable material;    wherein the cover tape has been shrunk by application of heat after application of the cover tape to the carrier tape.    
   
   
       2 . The carrier medium of  claim 1 , wherein each of the retaining areas comprises a pocket formed in the carrier tape.  
   
   
       3 . The carrier medium of  claim 2 , wherein each of the retaining areas further comprises a raised feature disposed on the carrier tape proximate a periphery of the pocket.  
   
   
       4 . The carrier medium of  claim 1 , wherein each of the retaining areas comprises a raised feature disposed on the carrier tape, the raised feature defining at least a portion of a periphery of the retaining area.  
   
   
       5 . The carrier medium of  claim 1 , wherein the component comprises an integrated circuit die.  
   
   
       6 . The carrier medium of  claim 1 , wherein the cover tape comprises a heat shrinkable polymer material.  
   
   
       7 . A carrier tape comprising; 
 a base, the base having an upper surface;    a number of pockets formed in the base, each pocket extending downward below the upper surface; and    a number of raised features disposed on the base, each raised feature extending upwards from the upper surface and located proximate a periphery of one of the pockets.    
   
   
       8 . The carrier tape of  claim 7 , wherein each of the raised features extends about a portion of the periphery of the one pocket.  
   
   
       9 . The carrier tape of  claim 7 , wherein each of the raised features extends fully around the periphery of the one pocket.  
   
   
       10 . The carrier tape of  claim 7 , wherein each of the pockets is capable of receiving an integrated circuit die.  
   
   
       11 . The carrier tape of  claim 7 , wherein the base comprises a material selected from a group consisting of polycarbonate and highly carbon black reinforced polystyrene.  
   
   
       12 . A carrier tape comprising: 
 a base, the base having an upper surface; and    a number of raised features disposed on the base and extending upwards from the upper surface;    wherein a number of retaining areas are provided on the base, each of the retaining areas defined by at least one of the raised features.    
   
   
       13 . The carrier tape of  claim 12 , wherein each of the raised features extends about a portion of a periphery of one of the retaining areas.  
   
   
       14 . The carrier tape of  claim 12 , wherein each of the raised features extends fully around a periphery of one of the retaining areas.  
   
   
       15 . The carrier tape of  claim 12 , wherein each of the retaining areas is capable of receiving an integrated circuit die.  
   
   
       16 . The carrier tape of  claim 12 , wherein the base comprises a material selected from a group consisting of polycarbonate and highly carbon black reinforced polystyrene.  
   
   
       17 . A method comprising: 
 placing a die in a retaining area of a carrier tape;    applying a cover tape to the carrier tape, the cover tape overlying the retaining area, 
 wherein the cover tape comprises of a heat shrinkable material; and  
   applying heat to the cover tape to shrink the cover tape.    
   
   
       18 . The method of  claim 17 , further comprising securing the cover tape to the carrier tape using an adhesive.  
   
   
       19 . The method of  claim 17 , wherein the cover tape is secured to carrier tape by shrinkage of the cover tape.  
   
   
       20 . A system comprising: 
 a pick-and-place mechanism to place a die in a pocket of the carrier tape;    an applicator to apply a cover tape to the carrier tape, wherein the cover tape comprises a heat shrinkable material; and    a heat source to apply heat to the cover tape and shrink the cover tape.    
   
   
       21 . The system of  claim 20 , wherein the heat source comprises a device selected from a group consisting of a hot air blower, a heat lamp, an infrared heater, and an electric resistive element.  
   
   
       22 . The system of  claim 20 , further comprising a take-up reel to receive the carrier tape with the applied cover tape.