Printed circuit board and manufacturing method thereof

Abstract

A printed circuit board which is thin and incorporates a large-capacitance capacitor function and a manufacturing method thereof is disclosed. The printed circuit board manufacturing method includes the steps of: forming inner layer conductor circuits 32 A on a core substrate 30 ; forming a recess part 31 on the core substrate 30 ; housing, in a recess part 31 , a planar capacitor device 20 that is not resin molded and has electrodes on the surfaces on a shared side; interposing the same between insulator resin 43 and conductor metal foil 44 to heat pressurize the same for forming a multi-layer plate; forming via holes 41 A for electrically connecting an outer layer conductor circuit 42 A to the electrodes 21,22 of the capacitor device 20 ; forming a conductor layer on them; and forming the outer layer conductor circuits 42 A on the surfaces of the multi-layer plate.

1 - 6 . (canceled)  
     
     
         7 . A multi-layer printed circuit board manufacturing method, comprising the steps of: 
 forming circuit patterns on conductors of a core substrate having conductor layers;    forming a recess part on the core substrate;    housing, in the recess part, a capacitor device not resin molded;    forming insulator layers and conductor layers on the core substrate housing the capacitor device to form a multi-layer plate;    forming via holes for electrically connecting an outer conductor layer of the multi-layer plate to electrodes of the capacitor device to form a conductor layer on the via holes; and    forming conductor circuit patterns on the surfaces of the multi-layer plate.    
     
     
         8 . The multi-layer printed circuit board manufacturing method according to  claim 7 , wherein the capacitor device that has a planar shape and is formed with anode and cathode electrodes on the surfaces on a shared side is buried into the recess part.  
     
     
         9 . The multi-layer printed circuit board manufacturing method according to  claim 7 , wherein an unpackaged capacitor device that has a thickness of 300 μm or less is buried into the recess part.  
     
     
         10 . The multi-layer printed circuit board manufacturing method according to  claim 8 , wherein a capacitor device in which the surfaces of the anode and the cathode are subject to copper plating having a thickness of 10 to 30 μm and the difference in thickness between the anode and the cathode is 50 μm or less is buried into the recess part.  
     
     
         11 . The multi-layer printed circuit board manufacturing method according to  claim 8 , wherein via holes connecting an outer layer circuit pattern to electrodes of a buried capacitor are filled with copper plating or copper plating and conductive paste so that the surfaces thereof are flat.  
     
     
         12 . A multi-layer printed circuit board fabricating method comprising the steps of: 
 forming a recess part on a core substrate having conductor layers;    housing, in the recess part, a planar capacitor device that is not resin molded and is formed with anode and cathode electrodes on the surfaces on a shared side;    forming insulator layers on the core substrate housing the capacitor device;    forming a surface conductor layer on the insulator layer;    forming via holes for electrically connecting the surface conductor layer to the electrodes of the capacitor device; and    forming a conductor layer on the via holes to be conducted to the surface conductor layer.    
     
     
         13 . The multi-layer printed circuit board fabricating method according to  claim 12 , wherein 
 a sheet member having interlayer insulator resin and a metal film is stacked on the core substrate housing the capacitor device, and    the interlayer insulator resin is softened by heating to fill the insulator resin softened by vacuum pressurization in the recess part, and the surface of the stacked printed circuit board is formed to be flattened.    
     
     
         14 . A multi-layer printed circuit board manufactured by the method according to  claim 12 .  
     
     
         15 - 20 . (canceled)