Etcher for trimming photoresist

Abstract

A photoresist trimming process is described. An etcher equipped with an etching chamber, a wafer holder, a TCP source and a TCP window is provided. After plasma is generated in the etching chamber, the etching chamber is heated without a wafer therein, and the temperature at the TCP window is monitored simultaneously. It is started, at any time after the temperature at the TCP window reaches a predetermined one, to treat wafers with photoresist layers to be trimmed thereon through the etching chamber.

1 . An etcher for trimming photoresist, comprising: 
 an etching chamber;    a wafer holder in the etching chamber;    a transformer coupled plasma (TCP) source for generating plasma;    a TCP window in the etching chamber;    a temperature regulator for controlling temperature in the etching chamber; and    a temperature measuring means disposed at the TCP window.    
   
   
       2 . The etcher of  claim 1 , wherein the temperature measuring means comprises a thermal couple.  
   
   
       3 . The etcher of  claim 1 , wherein the temperature regulator has a feedback mechanism.  
   
   
       4 . The etcher of  claim 1 , wherein the wafer holder comprises an electrostatic chuck.