Wafer packing

Abstract

The present invention provides a wafer packing. The wafer packing includes a box, at least two sponges, at least two hollow support pads, and a plurality of wafers. The sponges are put on a bottom and under a lid of the box, the hollow support pads are put between sponges, and each wafer is put between adjacent hollow support pads touching a non-complete wafer area of each wafer.

1 . A wafer packing, the wafer packing comprising: 
 a cassette;    at least two sponges, the sponges respectively put on a bottom and under a lid of the cassette;    a plurality of hollow support pads, the hollow support pads put between the sponges on the bottom and under the lid of the cassette;    a plurality of wafers arranged in alternation with the plurality of hollow support pads, a non-complete wafer area of the each wafer touching adjacent hollow support pads.    
   
   
       2 . The wafer packing of  claim 1  wherein the hollow support pads are rounded pads, C-shaped pads, near rounded pads, and at least two arc pads.  
   
   
       3 . The wafer packing of  claim 2  wherein an angle of the C-shaped is larger than 180 degree.  
   
   
       4 . The wafer packing of  claim 2  wherein at least one of peripheries of the hollow support pads is toothlike in shape.  
   
   
       5 . The wafer packing of  claim 1  wherein a material of the hollow support pads is a plastic material, an electrically conducting material, or a magnetic material.  
   
   
       6 . The wafer packing of  claim 1  wherein a thickness of the hollow support pads is greater than 1 mm.  
   
   
       7 . The wafer packing of  claim 1  wherein a width of the hollow support pads is greater than 3 mm.