US2007068656A1PendingUtilityA1

Flat plate heat transfer device

Assignee: LS CABLE LTDPriority: Oct 2, 2003Filed: Sep 23, 2004Published: Mar 29, 2007
Est. expiryOct 2, 2023(expired)· nominal 20-yr term from priority
H10W 40/257H10W 40/73F28D 15/0233F28D 15/046F28D 15/02
36
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Claims

Abstract

Disclosed is a flat plate heat transfer device, which includes a thermal-conductive flat case installed between a heat source and a heat emitting unit and containing a working fluid which is evaporated with absorbing heat from the heat source and is condensed with emitting heat to the heat emitting unit; and one layer of mesh installed in the flat case and configured so that wires are woven to be alternately crossed up and down. A dispersion channel of a vapor is formed along a surface of the wire from a cross point of the mesh near the heat source, and a flow channel of a liquid is formed by means of a capillary phenomenon along a length direction of the wire from a mesh lattice near the heat emitting unit to a mesh lattice near the heat source.

Claims

exact text as granted — not AI-modified
1 . A flat plate heat transfer device, comprising: 
 a thermal-conductive flat case installed between a heat source and a heat emitting unit and containing a working fluid which is evaporated with absorbing heat from the heat source and is condensed with emitting heat to the heat emitting unit; and    one layer of mesh installed in the flat case and configured so that wires are woven to be alternately crossed up and down,    wherein a dispersion channel of a vapor is formed along a surface of the wire from a cross point of the mesh near the heat source, and a flow channel of a liquid is formed by means of a capillary phenomenon along a length direction of the wire from a mesh lattice near the heat emitting unit to a mesh lattice near the heat source.    
     
     
         2 . The flat plate heat transfer device according to  claim 1 , 
 wherein the mesh is a screen mesh with a mesh number of 10 to 60.    
     
     
         3 . The flat plate heat transfer device according to  claim 1 , 
 wherein the mesh is woven by wires with a diameter of 0.12 mm to 0.4 mm.    
     
     
         4 . The flat plate heat transfer device according to  claim 1 , 
 wherein the thermal-conductive flat case has a height of 0.3 mm to 1.0 mm.    
     
     
         5 . The flat plate heat transfer device according to  claim 1 , 
 wherein the flat case is configured by combination of an upper case and a lower case.    
     
     
         6 . The flat plate heat transfer device according to  claim 1 , 
 wherein the mesh is a screen mesh, and    wherein a length direction of a lengthwise wire among the wires is identical to a direction in which heat transfer is conducted.    
     
     
         7 . The flat plate heat transfer device according to  claim 1 , 
 wherein the thermal-conductive flat case is made of electrolytic copper foil, and    wherein an uneven surface of the electrolytic copper foil is configured as an inner side of the flat case.    
     
     
         8 . The flat plate heat transfer device according to  claim 1 , 
 wherein the mesh is made of one selected from the group consisting of metal, polymer, plastic, and glass fiber.    
     
     
         9 . The flat plate heat transfer device according to  claim 8 , 
 wherein the metal is selected from the group consisting of copper, aluminum, stainless steel, molybdenum, and their alloys.    
     
     
         10 . The flat plate heat transfer device according to  claim 1 , 
 wherein the flat case is made of one selected from the group consisting of metal, conductive polymer, metal coated with conductive polymer, and conductive plastic.    
     
     
         11 . The flat plate heat transfer device according to  claim 10 , 
 wherein the metal is selected from the group consisting of copper, aluminum, stainless steel, molybdenum, and their alloys.    
     
     
         12 . The flat plate heat transfer device according to  claim 1 , 
 wherein the flat case is sealed using a manner selected from the group consisting of laser welding, plasma welding, TIG (Tungsten Inert Gas) welding, ultrasonic welding, brazing, soldering, and thermo-compression lamination.    
     
     
         13 . The flat plate heat transfer device according to  claim 1 , 
 wherein the working fluid is selected from the group consisting of water, methanol, ethanol, acetone, ammonia, CFC working fluid, HCFC working fluid, HFC working fluid, and their mixture.

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