Perforation and grooving for polishing articles

Abstract

Methods, articles of manufacture, and apparatus are provided for depositing and planarizing one or more layers of material on a substrate, or combinations thereof, are disclosed. In one embodiment, an article of manufacture is provided for polishing a substrate, comprising a polishing article having a polishing surface, a plurality of perforations formed in at least a portion of the polishing article for flow of material therethrough, and a plurality of grooves disposed in the polishing surface. The article of manufacture may be used in a method for processing a substrate, comprising positioning the substrate in an electrolyte solution containing a polishing article, optionally depositing a material on the substrate by an electrochemical deposition method, and polishing the substrate with the polishing article.

1 . An article of manufacture for depositing and planarizing a material on a substrate, comprising: 
 a polishing article having center portion and a perimeter portion defining a polishing surface;    a plurality of passages formed through the polishing article for flow of material therethrough; and    a plurality of grooves disposed in the polishing surface.    
     
     
         2 . The article of  claim 1 , wherein at least one of the plurality of passages intersects with at least one of the plurality of grooves on the polishing surface.  
     
     
         3 . The article of  claim 1 , wherein each of the passages has a diameter of between about 0.016 and about 0.5 inches and are disposed between about 0.1 inches and about 1.0 inches from one another.  
     
     
         4 . The article of  claim 1 , wherein the plurality of grooves form a pattern comprising substantially circular concentric grooves, an X-Y pattern, or a triangular pattern on the polishing surface.  
     
     
         5 . The article of  claim 1 , wherein a portion of the plurality of grooves are non-intersecting and are spaced between about 0.03 inches and about 0.3 inches apart.  
     
     
         6 . The article of  claim 1 , wherein the polishing article is disposed on a perforated sub-pad.  
     
     
         7 . The article of  claim 6 , wherein the perforated sub-pad comprises a plurality of pores disposed therein for flow of material therethrough and the plurality of pores of the perforated sub-pad and the plurality of passages in the polishing article are aligned for flow of material through the perforated sub-pad and the polishing article.  
     
     
         8 . The article of  claim 1 , wherein the polishing article comprises a conductive material or a dielectric material having conductive elements disposed therein.  
     
     
         9 . The article of  claim 1 , wherein the center portion is conductive and the perimeter portion is dielectric.  
     
     
         10 . An article of manufacture for depositing and planarizing a material on a substrate, comprising: 
 a polishing article having a polishing surface and a plurality of holes disposed at least partially through the polishing article; and    a plurality of grooves disposed in the polishing surface, wherein an upper end of each of the plurality of holes is recessed below the polishing surface.    
     
     
         11 . The article of  claim 10 , wherein the polishing surface is conductive.  
     
     
         12 . The article of  claim 10 , wherein the polishing surface is a conductive polymer.  
     
     
         13 . The article of  claim 10 , wherein the polishing surface comprises a dielectric portion and a conductive portion.  
     
     
         14 . The article of  claim 10 , wherein the polishing article comprises a perimeter portion and a central opening, wherein the perimeter portion is dielectric and the central opening is adapted to receive one or more conductive elements.  
     
     
         15 . The article of  claim 10 , wherein the plurality of grooves form a pattern comprising substantially circular concentric grooves, an X-Y pattern, or a triangular pattern on the polishing surface.  
     
     
         16 . The article of  claim 10 , wherein a portion of the plurality of grooves are non-intersecting and are spaced between about 0.03 inches and about 0.3 inches apart.  
     
     
         17 . The article of  claim 10 , wherein the polishing article is disposed on a perforated sub-pad.  
     
     
         18 . A system for processing a substrate, comprising: 
 a platform having a rotating support;    a conductive layer coupled to the rotating support;    a polishing article coupled to the conductive layer with a sub-pad therebetween, the polishing article comprising: 
 a conductive polishing surface having a plurality of grooves formed therein, each of the plurality of grooves having a bottom, wherein a plurality of holes extend through the polishing article and intersects with the bottom of a portion of the plurality of grooves.  
   
     
     
         19 . The system of  claim 18 , wherein the conductive polishing surface includes a conductive polymer.  
     
     
         20 . The system of  claim 18 , wherein the sub-pad is dielectric.  
     
     
         21 . The system of  claim 18 , wherein the plurality of grooves form a pattern comprising substantially circular concentric grooves, an X-Y pattern, or a triangular pattern on the polishing surface.  
     
     
         22 . The system of  claim 18 , wherein a portion of the plurality of grooves are non-intersecting and are spaced between about 0.03 inches and about 0.3 inches apart.  
     
     
         23 . The system of  claim 18 , wherein the polishing article comprises a conductive material or a dielectric material having conductive elements disposed therein.  
     
     
         24 . The system of  claim 18 , wherein the sub-pad is perforated.