Wafer-edge polishing system

Abstract

A wafer-edge polishing device includes a buff member for polishing a semiconductor wafer, and a dresser for dressing the buff member, wherein the dresser opposes the buff member with an intervention of the semiconductor wafer. A wafer mount mounting thereon the semiconductor wafer and the dresser are respectively movable toward and from the buff member. The contact pressure between the wafer and the buff member as well as between the buff member and the dresser is fixed. The dresser performs in-situ dressing concurrently with polishing of the wafer by the buff member.

1 . A wafer-edge polishing system comprising: 
 a wafer mount for mounting thereon a wafer;    a polishing device movable toward and from said wafer mount and having a buff member for polishing an edge portion of the wafer mounted on said wafer mount;    a dresser movable toward and from said polishing device for dressing said buff member of said polishing device.    
   
   
       2 . The wafer-edge polishing system according to  claim 1 , wherein said polishing by said polishing device and said dressing by said dresser are performed concurrently.  
   
   
       3 . The wafer-edge polishing system according to  claim 1 , wherein said polishing by said polishing device and said dressing by said dresser are performed alternately.  
   
   
       4 . The wafer-edge polishing device according to  claim 1 , wherein said wafer mount, said buff member and said dresser are capable of being rotated with respect to respective central axes thereof independently from one another.  
   
   
       5 . The wafer-edge polishing device according to  claim 4 , wherein said buff member has a cylindrical surface capable of being in contact with said wafer and said dresser, said wafer mount and said dresser move periodically in a direction parallel to said central axes at least in a range wherein said wafer and said dresser are capable of being in contact with said cylindrical surface, and periodical movement of said wafer mount has a period same as a period of periodical movement of said dresser and a phase opposite with respect to a phase of said periodical movement of said dresser.  
   
   
       6 . The wafer-edge polishing device according to  claim 1 , further comprising a pressure controller for controlling the contact pressure between the wafer and said buff member and/or the contact pressure between said dresser and said buff member.