Lamination apparatus and lamination method using the same

Abstract

The present invention is directed to a lamination apparatus and a lamination method using the same. The lamination apparatus includes a process chamber and a pump connected with one side of the process chamber for making the interior of the process chamber a vacuum. Inside the process chamber, a first and a second supply unit, an injection unit, and a bonding unit are provided. The first and the second supply units supply a first and a second metal sheet, respectively. The injection unit injects a bonding material between the first and the second metal sheets supplied, and the bonding unit bonds the first and the second metal sheets with each other. According to the present invention, a bonding force of the bonding material may be enhanced and various kinds of bonding materials may be used.

1 . A lamination apparatus comprising: 
 a process chamber;    a first and a second supply unit disposed inside the process chamber for supplying a first and a second metal sheet, respectively;    an injection unit for injecting a bonding material between the first and the second metal sheets supplied;    a bonding unit for bonding the first and the second metal sheets with each other; and    a pump connected to one side of the process chamber for making the interior of the process chamber a vacuum.    
   
   
       2 . The lamination apparatus of  claim 1 , wherein the metal sheets are tape-type sheets, respectively; 
 wherein the first and the second supply units are a first and a second reel, respectively; and    wherein the tape-type first and second metal sheets are supplied by rotation of the first and second reels.    
   
   
       3 . The lamination apparatus of  claim 2 , wherein the first and the second reels are different in width.  
   
   
       4 . The lamination apparatus of  claim 2 , wherein the bonding unit is a roller for rolling the first and the second metal sheets to closely stick and bond the same to each other.  
   
   
       5 . The lamination apparatus of  claim 2 , further comprising a third reel on which the metal sheets bonded by the bonding unit are wound.  
   
   
       6 . The lamination apparatus of  claim 1 , wherein the bonding unit bonds the first and the second metal sheets by closely sticking the same to each other.  
   
   
       7 . The lamination apparatus of  claim 1 , further comprising a heater for heating the metal sheets bonded by the bonding unit to enhance a bonding force of the first and the second metal sheets.  
   
   
       8 . The lamination apparatus of  claim 7 , wherein the heater is one selected from the group consisting of a high-frequency induction heater, an infrared heater, and a halogen heater.  
   
   
       9 . The lamination apparatus of  claim 7 , wherein the heater is installed inside the bonding unit.  
   
   
       10 . The lamination apparatus of  claim 1 , wherein the injection unit is a metal evaporator.  
   
   
       11 . The lamination apparatus of  claim 1 , wherein an injection outlet of the injection unit has the same width as the first or the second metal sheet.  
   
   
       12 . The lamination apparatus of  claim 1 , further comprising a position adjuster for adjusting a position of the injection unit relative to the bonding unit.  
   
   
       13 . The lamination apparatus of  claim 1 , further comprising a temperature controller connected with the injection unit for controlling a temperature of the injection unit.  
   
   
       14 . The lamination apparatus of  claim 1 , further comprising a heat shielding film interposed between the first metal sheet and the injection unit and between the second metal sheet and the injection unit.  
   
   
       15 . The lamination apparatus of  claim 1 , further comprising an adsorption sheet disposed between the process chamber and the pump for adsorbing a vapor of the bonding material to prevent the bonding material from flowing into the pump.  
   
   
       16 . A lamination method comprising: 
 making the interior of a process chamber a vacuum, the process chamber including a first and a second metal sheet;    supplying the first and the second metal sheets;    injecting a bonding material between the first and the second metal sheets supplied;    bonding the first and the second metal sheets with each other; and    heating the bonded metal sheets.    
   
   
       17 . The lamination method of  claim 16 , wherein the first metal sheet is a superconductive tape, and the second metal sheet is a stabilization metal tape.  
   
   
       18 . The lamination method of  claim 17 , wherein a width of the superconductive tape is smaller than that of the stabilization metal tape.  
   
   
       19 . The lamination method of  claim 18 , wherein the superconductive tape includes a protective film, a superconductive film, a buffer film, and a substrate film that are stacked in the order named.  
   
   
       20 . The lamination method of  claim 19 , wherein the bonding material surrounds the superconductive tape.  
   
   
       21 . The lamination method of  claim 17 , wherein injection of the bonding material is done by means of metallic evaporation.  
   
   
       22 . The lamination method of  claim 21 , wherein the metallic evaporation is 
 performed by heating using a heater or high-frequency induction heating.    
   
   
       23 . The lamination method of  claim 17 , wherein heating the bonded metal sheets is done by means of one selected from the group consisting of high-frequency induction heating, infrared heating, and heating using a halogen heater.