Heat dissipation module and heat pipe thereof

Abstract

A heat dissipation module includes a heat pipe and at least one fin, which is connected to and disposed on an external surface of the heat pipe. The heat pipe includes a casing, a wick and a working fluid. The casing has an accommodating space and a bottom portion. The bottom portion has an uneven surface facing the accommodating space. The wick is disposed over the uneven surface of the bottom portion and the working fluid is filled within the casing.

1 . A heat pipe, comprising: 
 a casing having an accommodating space and a bottom portion, the bottom portion having an uneven surface facing the accommodating space;    a wick disposed on the surface; and    a working fluid filled within the casing.    
   
   
       2 . The heat pipe according to  claim 1 , wherein the casing comprises copper, silver, aluminum or alloy thereof, or a material with high thermal conductivity.  
   
   
       3 . The heat pipe according to  claim 1 , wherein the casing is a hollow plate-like casing or a hollow column-like casing.  
   
   
       4 . The heat pipe according to  claim 1 , wherein the casing further has a cover plate opposite to the bottom portion, and a sidewall mounted around the bottom portion.  
   
   
       5 . The heat pipe according to  claim 1 , wherein a cross section of the bottom portion of the casing has a semi-spheral shape, an arc shape, a triangular shape, a square shape, a rectangular shape or a trapezoidal shape, and the bottom portion has a circular or rectangular profile.  
   
   
       6 . The heat pipe according to  claim 1 , wherein the surface is formed with at least one protrusion or a plurality of protrusions arranged in a checkerboard pattern, a pattern in a row, a symmetrical pattern or an asymmetrical pattern.  
   
   
       7 . The heat pipe according to claim l, wherein the wick is disposed over the surface such that the wick faces the accommodating space to form a plane.  
   
   
       8 . The heat pipe according to  claim 7 , wherein the wick has a first thickness and a second thickness in a direction perpendicular to the bottom portion, and the first thickness is relatively greater than the second thickness.  
   
   
       9 . The heat pipe according to  claim 1 , wherein the wick is disposed along a profile of the surface, and the wick on the surface has a uniform thickness or a varied thickness.  
   
   
       10 . A heat dissipation module, comprising: 
 a heat pipe comprising a casing, a wick and a working fluid, the casing having an accommodating space and a bottom portion, the bottom portion having an uneven surface facing the accommodating space, the wick being disposed on the surface, and the working fluid being filled within the casing; and    at least one fin disposed on an external surface of the heat pipe and connected to the heat pipe.    
   
   
       11 . The heat dissipation module according to  claim 10 , wherein the casing comprises copper, silver, aluminum or alloy thereof, or a material with high thermal conductivity.  
   
   
       12 . The heat dissipation module according to  claim 10 , wherein the casing is a hollow plate-like casing or a hollow column-like casing.  
   
   
       13 . The heat dissipation module according to  claim 10 , wherein the casing further has a cover plate opposite to the bottom portion, and a sidewall mounted around the bottom portion.  
   
   
       14 . The heat dissipation module according to  claim 10 , wherein a cross section of the bottom portion of the casing has a semi-spherical shape, an arc shape, a triangular shape, a square shape, a rectangular shape or a trapezoidal shape, and the bottom portion has a circular or rectangular profile.  
   
   
       15 . The heat dissipation module according to  claim 10 , wherein the surface is formed with at least one protrusion or a plurality of protrusions arranged in a checkerboard pattern, a pattern in a row, a symmetrical pattern or an asymmetrical pattern.  
   
   
       16 . The heat dissipation module according to  claim 10 , wherein the wick is disposed over the surface such that the wick faces the accommodating space to form a plane.  
   
   
       17 . The heat dissipation module according to  claim 16 , wherein the wick has a first thickness and a second thickness in a direction perpendicular to the bottom portion, and the first thickness is relatively greater than the second thickness.  
   
   
       18 . The heat dissipation module according to  claim 10 , wherein the wick is disposed along a profile of the surface, and the wick on the surface has a uniform thickness or a varied thickness.  
   
   
       19 . The heat dissipation module according to  claim 10 , wherein the heat pipe contacts a heat source via a base or contact the heat source directly so as to transfer heat emitted by the heat source to the fin.