US2007056454A1PendingUtilityA1
System and apparatus for forming an imprinting tool
Est. expiryJun 5, 2023(expired)· nominal 20-yr term from priority
Inventors:Michael Walk
H05K 3/107B29C 33/3842B29C 33/40H05K 3/0002H05K 2203/0108B33Y 80/00
51
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Claims
Abstract
Numerous embodiments of a method and apparatus for forming an imprinting tool are disclosed. In one embodiment, an apparatus for forming a substrate-imprinting tool comprises a build platform configured to receive material, a first mold formed on the build platform, the first mold having first mold feature surfaces, and a second mold formed on the first mold feature surfaces, wherein at least a portion of the second mold is metalized.
Claims
exact text as granted — not AI-modified1 . A substrate-imprinting tool comprising:
a feature surface; and a base integral with the feature surface, the feature surface and the base substantially formed from molded metal, wherein the feature surface is configured to form one or more features on a substrate.
2 . The imprinting tool of claim 1 , wherein the feature surface and the base are substantially comprised of metal.
3 . The imprinting tool of claim 1 , wherein the feature surface is formed at least in part with one or more molds.
4 . The imprinting tool of claim 1 , wherein the molded metal is selected from the group consisting of nickel, copper, aluminum, and any combination thereof.
5 . The imprinting tool of claim 1 , wherein the substrate comprises an electronic device substrate.
6 . The imprinting tool of claim 1 , wherein the feature surface comprises features configured to imprint one or more features on a resin substrate.
7 . An apparatus for forming a substrate-imprinting tool comprising:
a build platform; a first mold formed on the build platform with deposited material, the first mold having first mold feature surfaces; and a second mold formed on the first mold feature surfaces, wherein at least a portion of the second mold is metalized.
8 . The apparatus of claim 7 wherein the imprinting tool is annealed, machined or polished.
9 . The apparatus of claim 7 wherein the deposited material is a curable polymer resin.
10 . The apparatus of claim 7 wherein at least a portion of the first mold is metalized.
11 . The apparatus of claim 10 wherein metal used to metalize the first mold is selected from the group consisting of nickel, copper, aluminum and any combination thereof.
12 . The apparatus of claim 7 wherein at least a portion of the second mold is formed with coated material.
13 . The apparatus of claim 12 wherein the coated material is a curable polymer.
14 . The apparatus of claim 13 wherein metal used to metalize the second mold is selected from the group consisting of nickel, copper, aluminum and any combination thereof.
15 . A system for forming a substrate-imprinting tool comprising:
a build platform; an ink jet head coupled to the build platform and configured to traverse the build platform and deposit material thereon; a first mold formed on the build platform with deposited material, the first mold having first mold feature surfaces; and a second mold formed on the first mold feature surfaces, wherein at least a portion of the second mold is metalized.
16 . The system of claim 15 further comprising means for curing the deposited material.
17 . The system of claim 16 wherein the means for curing the deposited material is an ultraviolet lamp.
18 . The system of claim 15 wherein at least a portion of the first mold is metalized.
19 . The system of claim 15 wherein at least a portion of the second mold is formed with coated material.
20 . The system of claim 19 further comprising temperature elevating means to cure the coated material.Join the waitlist — get patent alerts
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