US2007056403A1PendingUtilityA1

Electroconductive fine particle, method of producing electroconductive fine particle, and anisotropic electroconductive material

Assignee: SONY CORPPriority: Jul 15, 2004Filed: Jul 14, 2005Published: Mar 15, 2007
Est. expiryJul 15, 2024(expired)· nominal 20-yr term from priority
Inventors:Takashi Kubota
B22F 1/18B22F 1/10C23C 18/44C23C 18/1651H05K 3/323C23C 18/42H01B 1/22H01R 13/03H01B 5/00
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Claims

Abstract

The present invention aims to provide electroconductive fine particles having excellent electrical conductivity with fewer pinholes in a gold coating, a method of producing the electroconductive fine particles, which are cyan-free type with a plating bath excellent in stability, and an anisotropic electroconductive material using the electroconductive fine particles. The present invention is an electroconductive fine particle, which has a gold coating formed by electroless gold plating on the surface of a nickel undercoating, the amount of nickel dissolved in a dissolution test of the electroconductive fine particle with nitric acid being 30 to 100 μ/g; a method of producing the electroconductive fine particle, wherein the method allows a reducing agent, causing oxidation reaction on the surface of a nickel undercoating but not causing oxidation reaction on the surface of gold as deposited metal, to be present on the surface of the nickel undercoating thereby reduces a gold salt to deposit gold; and an anisotropic electroconductive material, which comprises the electroconductive fine particle dispersed in a resin binder.

Claims

exact text as granted — not AI-modified
1 . An electroconductive fine particle, 
 which has a gold coating formed by electroless gold plating on the surface of a nickel undercoating,    the amount of nickel dissolved in a dissolution test of the electroconductive fine particle with nitric acid being 30 to 100 μg/g.    
   
   
       2 . A method of producing the electroconductive fine particle according to  claim 1 , 
 wherein the method allows a reducing agent, causing oxidation reaction on the surface of a nickel undercoating but not causing oxidation reaction on the surface of gold as deposited metal, to be present on the surface of the nickel undercoating thereby reduces a gold salt to deposit gold.    
   
   
       3 . An anisotropic electroconductive material, 
 which comprises the electroconductive fine particle according to  claim 1  dispersed in a resin binder.

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