Apparatus and method of controlling the temperature of polishing pads used in planarizing micro-device workpieces

Abstract

Temperature regulation systems and methods for controlling the temperature of polishing pads used in planarizing micro-device workpieces are disclosed herein. In one embodiment, an apparatus for polishing a workpiece includes a platen defining a planarizing zone and a primary duct system. The platen can have a first duct, and the primary duct system can have a second duct operatively coupled to the first duct of the platen. The second duct is configured to direct a gas flow laterally relative to the planarizing zone. The apparatus also includes a pad support carried by the primary duct system, and a polishing pad carried by the pad support. The pad support can have a plurality of apertures that are in fluid communication with the gas flow in the second duct.

1 - 55 . (canceled)  
     
     
         56 . A method for controlling the temperature of a polishing pad, comprising: 
 causing a gas flow through a duct system under a polishing pad; and    maintaining a desired temperature of the polishing pad with the gas flow.    
     
     
         57 . The method of  claim 56  wherein causing a gas flow comprises forcing gas to move through the duct system by coupling the duct system to a vacuum or a blower.  
     
     
         58 . The method of  claim 56  wherein causing a gas flow comprises flowing the gas in apertures in a pad support.  
     
     
         59 . The method of  claim 56  wherein causing a gas flow comprises moving gas through a duct extending through a platen.  
     
     
         60 . The method of  claim 56  wherein causing a gas flow comprises moving gas through a duct extending through the polishing pad.  
     
     
         61 . The method of  claim 56  wherein causing a gas flow comprises flowing gas radially through the duct system.  
     
     
         62 . The method of  claim 56  wherein causing a gas flow comprises driving gas into the duct system by rotating ducts with curved walls.  
     
     
         63 . The method of  claim 56 , further comprising flowing the gas flow through a heat exchanger.  
     
     
         64 . The method of  claim 56 , further comprising changing the temperature of the pad.  
     
     
         65 . The method of  claim 56  wherein maintaining a desired temperature comprises changing the temperature of the gas.  
     
     
         66 . The method of  claim 56  wherein maintaining a desired temperature comprises changing the flow rate of the gas.  
     
     
         67 . A method for controlling the temperature of a polishing pad, comprising: 
 rotating a platen having a plurality of channels;    causing a gas flow through at least some of the plurality of channels;    passing the gas flow at least proximate to the pad; and    regulating the temperature of the pad by controlling the temperature or flow rate of the gas.    
     
     
         68 . The method of  claim 67  wherein causing a gas flow comprises forcing gas to move through the plurality channels by coupling the plurality of channels to a vacuum or a blower.  
     
     
         69 . The method of  claim 67  wherein causing a gas flow comprises moving the gas through a duct extending through the platen.  
     
     
         70 . The method of  claim 67  wherein passing the gas flow comprises flowing the gas in apertures in a pad support.  
     
     
         71 . The method of  claim 67 , further comprising flowing the gas flow through a heat exchanger.  
     
     
         72 . The method of  claim 67  wherein causing a gas flow comprises flowing the gas through a duct extending through the pad and a pad support.  
     
     
         73 . A method for controlling the temperature of a polishing pad, comprising: 
 flowing gas into a duct system between a polishing pad and a platen; and    exhausting the gas from the duct system.    
     
     
         74 . The method of  claim 73  wherein flowing gas comprises forcing gas to move through the duct system by coupling the duct system to a vacuum or a blower.  
     
     
         75 . The method of  claim 73  wherein flowing gas comprises passing gas through a duct extending through the platen.  
     
     
         76 . The method of  claim 73 , further comprising moving the gas proximate to the polishing pad to change the temperature of the polishing pad.  
     
     
         77 . The method of  claim 73  wherein flowing gas comprises passing the gas in apertures in a pad support.  
     
     
         78 . The method of  claim 73  wherein flowing gas comprises moving gas through a duct extending through the polishing pad.  
     
     
         79 . The method of  claim 73  wherein flowing gas comprises flowing gas radially through the duct system.  
     
     
         80 . The method of  claim 73  wherein flowing gas comprises driving gas into the duct system by rotating ducts with curved walls.  
     
     
         81 . The method of  claim 73 , further comprising flowing the gas through a heat exchanger.  
     
     
         82 . The method of  claim 73 , further comprising changing the temperature of the pad.  
     
     
         83 . The method of  claim 73 , further comprising changing the temperature of the gas.  
     
     
         84 . The method of  claim 73 , further comprising changing the flow rate of the gas.  
     
     
         85 . A method for cooling the temperature of a polishing pad, comprising: 
 moving gas in an inlet and into a channel;    passing the gas through the channel and proximate to a pad support;    cooling the pad support with the passing gas; and    reducing the temperature of the polishing pad coupled to the pad support.    
     
     
         86 . The method of  claim 85 , further comprising flowing gas through a duct extending through a platen.  
     
     
         87 . A method for planarizing a micro-device workpiece with a temperature control, comprising: 
 pressing the micro-device workpiece against a pad;    imparting relative motion between the micro-device workpiece and the pad;    causing a gas flow through a duct system under the pad; and    regulating the temperature of the pad by controlling the temperature and/or flow rate of the gas.    
     
     
         88 . The method of  claim 87  wherein causing a gas flow comprises flowing gas in apertures in a pad support.  
     
     
         89 . The method of  claim 87  wherein causing a gas flow comprises flowing gas radially through the duct system.