Methods of fabricating and using shaped springs

Abstract

A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is deformed. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume) resulting in the deformation of the interconnection element.

1 - 50 . (canceled)  
   
   
       51 . A method comprising: 
 creating an interconnection element comprising a first element material, the interconnection element having a base and a free end, the base being coupled to a contact node on a substrate, the free end extending over masking material patterned on the substrate;    coupling a shape memory alloy to the interconnection element; and    transforming the volume of the shape memory alloy.    
   
   
       52 . The method of  claim 51  wherein the transforming causes the interconnection element to curve away from the substrate.  
   
   
       53 . The method of  claim 51  wherein the transforming transforms the shape memory alloy between a martinsite state and an austenite state.  
   
   
       54 . The method of  claim 51  wherein the transforming is caused by subjecting the interconnection element to a selected one of heat, pressure, or radiation.  
   
   
       55 . The method of  claim 51  wherein the coupling a shape memory alloy comprises laminating the shape memory alloy to the first element material while the alloy is in a stretched state.  
   
   
       56 . The method of  claim 51  further comprising patterning the shape memory alloy into a beam overlying a portion of the first element material of the interconnection element.  
   
   
       57 . The method of  claim 56  wherein the beam covers a substantial length of the free end of the interconnection element.  
   
   
       58 . The method of  claim 51  further comprising removing the masking material from the substrate.  
   
   
       59 . The method of  claim 51  further comprising removing the shape memory alloy from the interconnection element.  
   
   
       60 . The method of  claim 59  wherein the interconnection element maintains the same shape that it had prior to the removal of the shape memory alloy.  
   
   
       61 . The method of  claim 51  further comprising annealing the interconnection element.  
   
   
       62 . The method of  claim 51  further comprising creating a plurality of the interconnection elements.  
   
   
       63 . The method of  claim 51  wherein the shape memory alloy comprises a nickel-titanium alloy.  
   
   
       64 . The method of  claim 51  wherein the shape memory alloy comprises a copper-based alloy.  
   
   
       65 . A method comprising: 
 creating an interconnection element comprising a first element material, the interconnection element having a base and a free end, the base being coupled to a contact node on a substrate;    coupling a shape memory alloy in a stretched state over a portion of the first element material; and    shrinking the volume of the shape memory alloy, thereby causing the alloy to pull the free end away from the substrate.    
   
   
       66 . The method of  claim 65  further comprising patterning the stretched shape memory alloy into a beam overlying a portion of the first element material of the interconnection element.  
   
   
       67 . The method of  claim 66  wherein the beam covers a substantial length of the free end of the interconnection element.  
   
   
       68 . The method of  claim 65  wherein the creating an interconnection element comprises creating the free end on a masking material disposed on the substrate, the method further comprising removing the masking material from the substrate.  
   
   
       69 . A method comprising: 
 coupling a shape memory alloy to an interconnection element attached to a substrate; and    heating the shape memory alloy, thereby causing the interconnection element to curve away from the substrate.    
   
   
       70 . The method of  claim 69  further comprising providing a curvature stop to limit the degree to which the interconnection element curves away from the substrate.