Droplet applying method and droplet applying device, and device and electronic equipment

Abstract

Exemplary embodiments enable formation of a uniform film and a pattern with a minute line width and generate no or substantially no quality defects, such as disconnection. A droplet is discharged from a droplet discharging head to apply in a predetermined region on a surface of a substrate while relatively moving the droplet discharging head and the substrate. The droplet is discharged with respect to the surface of the substrate in a direction intersecting with a vertical direction, and when relatively moving the droplet discharging head and the substrate to discharge the droplet, the droplet is discharged along the relative movement direction.

1 . A droplet applying device for use with a substrate surface, the droplet applying device, comprising: 
 a droplet discharging head that discharges a droplet to apply on the substrate surface, the droplet discharging head being arranged in an inclined state with respect to a direction perpendicular to the substrate surface so as to discharge the droplet in a direction intersecting the direction perpendicular to the substrate surface.    
     
     
         2 . A device manufactured by applying a droplet on a surface of a substrate, the droplet being applied by a droplet applying method, comprising: 
 discharging the droplet from a droplet discharging head to apply in a predetermined region on a substrate surface, while relatively moving the droplet discharging head and the substrate, the discharging including:    discharging the droplet to the substrate surface in a direction intersecting a vertical direction, and discharging, when the droplet discharging head and the substrate are relatively moved to discharge the droplet, the droplet along the relative movement direction.    
     
     
         3 . Electronic equipment, comprising: 
 the device according to  claim 2.