Heat-dissipating device with thin fins

Abstract

A heat-dissipating device with a base and multiple fins is described. The base has multiple grooves formed periodically thereon. Each of the fins has an end formed with a folded portion. The ends with the folded portions are thicker than the fins themselves and fixed within the grooves of the base. The fins can be made thinner than conventional ones. Hence, the number of the fins of the heat-dissipating device can be increased to enhance the heat-dissipating efficiency thereof. Furthermore, the grooves of the present invention can be made wider, so the manufacture of the present invention is easy and the overall cost is low.

1 . A heat-dissipating device, comprising: 
 a base, including a plurality of grooves formed periodically thereon; and    a plurality of fins, wherein each fin has an end formed with a folded portion, ends with the folded portions being thicker than the fins themselves, and the ends with the folded portions being fixed within the grooves of the base.    
   
   
       2 . The heat-dissipating device as claimed in  claim 1 , wherein the folded portions are formed at lower ends of the fins.  
   
   
       3 . The heat-dissipating device as claimed in  claim 1 , wherein the base is made of copper or aluminum.  
   
   
       4 . The heat-dissipating device as claimed in  claim 1 , wherein the base has a central portion and two wing portions extending from the central portion, and the grooves are formed periodically on the central portion and the wing portions.  
   
   
       5 . The heat-dissipating device as claimed in  claim 1 , wherein the fins are made of copper or aluminum.  
   
   
       6 . The heat-dissipating device as claimed in  claim 1 , wherein the base is first heated and thus softened, and two opposite sides of the base are then pressed equivalently by an external force to change a shape of the grooves, thereby clipping the ends with the folded portions.