Precious metal solder

Abstract

Platinum, silver and gold solder compositions for repairing, assembling, or sizing jewelry. Platinum compositions having about 90% to about 95% by weight platinum. Silver compositions having at least 92.5% by weight silver. Gold solder compositions having about 25% to about 91.6% gold. The platinum and silver solder compositions further consisting of about 8.3% to about 75% by weight of an alloy consisting essentially of gallium, indium and copper in respective ratios of 6:3:1. The gold solder compositions further consisting of about 2% to about 14% by weight of an alloy consisting essentially of gallium, indium, and copper in respective ratios of 6:3:1. The melting temperature ranges of the respective solder compositions are from about 1300° C. to about 1500° C. for platinum, from about 1000° F. to about 1400° F. for silver, and from about 1100° F. to about 1550° F.

1 . A precious metal composition comprising of about 25% to 92% by weight gold mixture and an alloy, wherein the composition is free of palladium.  
   
   
       2 . The composition of  claim 1 , wherein the alloy comprises about 2% to 14% by weight gallium, indium and copper in a respective weight ratio of approximately 6:3:1.  
   
   
       3 . The composition of claim, wherein the mixture further comprises about 8% to 80% silver, about 1% to 66% copper, about 5% to 31% zinc and about 0% to 35% nickel.  
   
   
       4 . The composition of  claim 1 , wherein the mixture is about 25% by weight gold.  
   
   
       5 . The composition of  claim 1 , wherein the mixture is about 41.6% by weight gold.  
   
   
       6 . The composition of  claim 1 , wherein the mixture is about 58.3% by weight gold.  
   
   
       7 . The composition of  claim 1 , wherein the mixture is about 75% by weight gold.  
   
   
       8 . The composition of  claim 1 , wherein the mixture is about 91.6% by weight gold.  
   
   
       9 . The precious metal composition of  claim 1 , wherein the composition has a melting temperature lower than a precious metal composition in the presence of palladium.  
   
   
       10 . The precious metal composition of  claim 1 , wherein the composition has a melting temperature in the range from about 1000° F. to 1550° F.  
   
   
       11 . The precious metal composition of  claim 1 , wherein the composition has a melting temperature in the range from about 1100° F. to 1550° F.  
   
   
       12 . A precious metal composition comprising of about 25% to 92% by weight gold mixture and an alloy comprising about 2% to 14% by weight gallium, indium and copper in a respective weight ratio of approximately 6:3:1, and wherein the composition is free of palladium.