Apparatus and methods for using high frequency chokes in a substrate deposition apparatus

Abstract

In certain aspects, a substrate deposition apparatus, including a gas tube coupled to a gas source, an RF power source and a substrate processing chamber, is provided. The gas tube is adapted to carry process gas and cleaning plasma from the gas source/remote plasma gas source to the substrate processing chamber and the RF power source is adapted to couple RF power to the substrate processing chamber. Furthermore an RF choke coupled to the RF power source and the gas source wherein the RF choke is adapted to attenuate a voltage difference between the RF power source and the gas source to prevent plasma formation in the gas tube during substrate processing. Numerous other aspects are provided.

1 . A substrate deposition apparatus, comprising: 
 a gas tube coupled to a gas source, an RF power source and a substrate processing chamber,    wherein the gas tube is adapted to carry gas from the gas source to the substrate processing chamber, and    wherein the RF power source is adapted to couple RF power to the substrate processing chamber; and    an RF choke coupled to the RF power source and the gas source,    wherein the RF choke is adapted to attenuate a voltage difference between the RF power source and the gas source.    
   
   
       2 . The apparatus of  claim 1 , wherein the gas tube is disposed within the RF choke.  
   
   
       3 . The apparatus of  claim 1 , wherein the RF choke includes a wire wrapped into a coil.  
   
   
       4 . The apparatus of  claim 3 , wherein the RF choke further includes a core disposed inside the wire wrapped into a coil.  
   
   
       5 . The apparatus of  claim 4 , wherein the core is adapted to ensure the pitch of the coil is substantially constant.  
   
   
       6 . The apparatus of  claim 3 , wherein the wire is coated with a dielectric material.  
   
   
       7 . The apparatus of  claim 6 , wherein the RF choke further includes a core disposed inside the wire wrapped into a coil.  
   
   
       8 . The apparatus of  claim 1 , wherein the gas tube includes a dielectric material.  
   
   
       9 . The apparatus of  claim 8 , wherein the RF choke includes a wire wrapped into a coil.  
   
   
       10 . The apparatus of  claim 9 , wherein the RF choke further includes a core disposed inside the wire wrapped into a coil.  
   
   
       11 . The apparatus of  claim 10 , wherein the core is adapted to ensure the pitch of the coil is substantially constant.  
   
   
       12 . The apparatus of  claim 3 , wherein the wire is coated with a dielectric material.  
   
   
       13 . The apparatus of  claim 12 , wherein the gas tube is disposed inside the coil.  
   
   
       14 . The apparatus of  claim 1 , wherein the RF choke is further adapted to approximately uniformly attenuate the voltage difference between the RF power source and the gas delivery system.  
   
   
       15 . A method, comprising: 
 providing a gas tube, a gas source, an RF power source and a substrate processing chamber;    carrying gas from the gas source to the substrate processing chamber via the gas tube;    coupling RF power to the substrate processing chamber;    providing an RF choke;    attenuating a voltage difference between the RF power source and the gas source with the RF choke.    
   
   
       16 . The method of  claim 15 , wherein providing an RF choke includes disposing the RF choke around the gas tube.  
   
   
       17 . The method of  claim 15 , wherein providing an RF choke includes providing a wire wrapped into a coil.  
   
   
       18 . The method of  claim 17 , wherein providing a wire wrapped into a coil includes disposing the wire around the gas tube.  
   
   
       19 . The method of  claim 18 , wherein disposing the wire around the gas tube further includes ensuring the pitch of the wire is substantially constant.  
   
   
       20 . The method of  claim 15 , wherein providing a gas tube includes providing dielectric material.  
   
   
       21 . The method of  claim 20 , wherein providing the RF choke includes providing a wire wrapped into a coil.  
   
   
       22 . The method of  claim 21 , wherein providing a wire wrapped into a coil includes disposing the wire around the gas tube.  
   
   
       23 . The method of  claim 22 , wherein disposing the wire around the gas tube further includes ensuring the pitch of the wire is substantially constant.  
   
   
       24 . The method of  claim 17 , wherein providing a wire wrapped into a coil includes providing a wire coated with dielectric material.  
   
   
       25 . The method of  claim 24 , wherein providing a wire coated with a dielectric material includes disposing the wire coated with a dielectric material around the gas tube.  
   
   
       26 . A choke for use with a substrate processing chamber, comprising: 
 a wire formed into a coil; and    a form disposed inside the coil,    wherein the form is adapted to ensure the pitch of the coil is substantially constant, and    wherein the wire is coated with a dielectric material.    
   
   
       27 . The choke of  claim 26 , further including a gas tube disposed inside the form.  
   
   
       28 . The choke of  claim 26 , wherein the choke is adapted to approximately uniformly attenuate a voltage difference between an RF power source and a gas delivery system.