Substrate-based white light diode

Abstract

A substrate-based white light diode construction and manufacturing process comprised of having a blue-light chip attached to a substrate; blue-light chip and substrate circuitry contact being connected with a gold plated wire; blue-light chip inlaid into cavity of a mold; and fluorescent glue powder or cake being filled and preheated into fluid before being compressed into the cavity to bind and cover up blue-light chip.

1 . A substrate-based white light diode manufacturing process includes the following steps: 
 Step A: a blue-light chip being attached to a substrate;    Step B: the blue-light chip being connected to the circuit contact of the substrate with a gold plated wire; and    Step C: A fluorescent glue powder or cake containing fluorescent powder and transparent insulation glue being injected to where the blue-light chip is connected with the gold plated wire, and the fluorescent glue is bound to the substrate to be hardened in shape under continuous heating and pressurizing; wherein, in the process for the fluorescent glue powder or cake to be heated and hardened, the fluorescent powder in the transparent insulation glue gradually flowing to the blue-light chip to cover up on the surface layer of the blue-light chip to become a fluorescent layer; and the process being concluded when the fluorescent glue turns into yellow insulation glue to become a yellow insulation layer.    
   
   
       2 . The substrate-based white light diode manufacturing process of  claim 1 , wherein the blue-light chip is attached to the substrate by means of a mounting gel, and the heated at 150° C. for one and half an hours to secure the blue-light chip onto the substrate.  
   
   
       3 . The substrate-based white light diode manufacturing process of  claim 1 , wherein, during the injection and hardening for the fluorescent glue powder or cake and the substrate, the substrate attached with the blue-light chip and the gold plated wire is placed in the preheated mold with the blue-light chip on the substrate inlaid into the cavity; and the fluorescent glue powder or cake in solid state is filled into the main runner of the mold by means of the extruder.  
   
   
       4 . A substrate-based white light diode is comprised of having a blue-light chip attached to a substrate; the blue-light chip being connected to the circuit contact of the substrate by means of a gold plate wire; the surface of the blue-light chip being coated with a fluorescent layer with a given wavelength of 430 mm˜475 mm; the blue-light chip including the gold plated wire and the fluorescent layer being covered up with a yellow insulation layer; the circuit contact of the substrate being conducted; the blue light emitted from the blue-light chip being radiated through the fluorescent layer with a given wavelength of 430˜475 mm; and the wavelength of the blue-light chip being incorporated with that from the fluorescent layer to present the white light effect.