US2007039818A1PendingUtilityA1

Method for fabricating a sputtering target

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Assignee: FUJITSU LTDPriority: Apr 9, 2002Filed: Oct 24, 2006Published: Feb 22, 2007
Est. expiryApr 9, 2022(expired)· nominal 20-yr term from priority
Inventors:Takashi Hasegawa
C23C 4/00C23C 4/01C23C 14/3414C23C 4/08
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Claims

Abstract

A sputtering target includes a backing plate and a copper target provided on the backing plate. A protection layer is formed on the surface of the copper target from a corrosion-resistant metal. Accordingly, the oxidation of the copper target can be suppressed. Thus, the formation of a contaminant layer on the shielding plate of the sputtering system can be suppressed, and resultantly the adhesion of particles to a substrate due to the release of a deposited layer on the surface of the shielding plate can be suppressed.

Claims

exact text as granted — not AI-modified
1 . A method for fabricating a sputtering target comprising the step of: forming a protection layer of a corrosion-resistant metal on the surface of a target base of copper.  
   
   
       2 . A method for fabricating a sputtering target according to  claim 1 , wherein in the step of forming the protection layer, the protection layer is formed on the surface of the target base without forming the protection layer in an outer circumferential vicinity of the surface of the target base.  
   
   
       3 . A method for fabricating a sputtering target according to  claim 1 , wherein in the step of forming the protection layer, the protection layer is formed thinner in an outer circumferential vicinity of the surface of the target base than in a remainder thereof.  
   
   
       4 . A method for fabricating a sputtering target according to  claim 1 , wherein in the step of forming the protection layer, the corrosion-resistant metal is coated on the surface of the target base by flame spraying.  
   
   
       5 . A method for fabricating a sputtering target according to  claim 2 , wherein in the step of forming the protection layer, the corrosion-resistant metal is coated on the surface of the target base by flame spraying.  
   
   
       6 . A method for fabricating a sputtering target according to  claim 3 , wherein in the step of forming the protection layer, the corrosion-resistant metal is coated on the surface of the target base by flame spraying.  
   
   
       7 . A method for fabricating a sputtering target according to  claim 1 , wherein the corrosion-resistant metal is aluminum, zinc, tin, nickel, magnesium, titanium, zirconium, vanadium, molybdenum or cobalt.  
   
   
       8 . A method for fabricating a sputtering target according to  claim 1 , further comprising the step of: 
 packaging the target base with the protection layer formed thereon by vacuum packaging.

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