Wet clean and drying method and apparatus

Abstract

Systems and techniques for cleaning, including a reservoir with a first portion and a second portion. The first portion is configured to contain fluid under a receiving surface of the fluid. The second portion is configured to contain fluid under a transmitting surface of the fluid separate from the receiving surface of the fluid.

1 . A substrate cleaning system comprising: 
 an input configured to receive fluid;    a reservoir configured to receive fluid from the input, the reservoir including a first portion and a second portion, wherein the first portion of the reservoir configured to contain fluid under a receiving surface of the fluid, and wherein the second portion of the reservoir is configured to contain fluid under a transmitting surface of the fluid separate from the receiving surface of the fluid; and    an output configured to receive fluid from the reservoir and to transmit fluid.    
   
   
       2 . The cleaning system of  claim 1 , wherein the reservoir further includes a third portion positioned between the first portion and the second portion.  
   
   
       3 . The cleaning system of  claim 1 , further comprising one or more heaters positioned to heat fluid in the reservoir.  
   
   
       4 . The cleaning system of  claim 1 , further comprising one or more transducers positioned to generate at least one of ultra-sonic and mega-sonic waves in the fluid.  
   
   
       5 . The cleaning system of  claim 1 , further comprising the fluid included in the first region and the second region.  
   
   
       6 . The cleaning system of  claim 1 , wherein the fluid comprises an aqueous solution.  
   
   
       7 . The cleaning system of  claim 1 , further comprising another inlet, the another inlet configured to provide one or more drying materials to the reservoir adjacent the transmitting surface.  
   
   
       8 . The cleaning system of  claim 1 , wherein the one or more drying materials comprises a solvent.  
   
   
       9 . A cleaning method comprising: 
 providing a reservoir including a cleaning solution;    introducing a part into the cleaning solution via a receiving surface of the cleaning solution;    substantially cleaning the part in a first region of the cleaning solution positioned at least partially under the receiving surface;    transmitting the part to a second region of the cleaning solution, the second region positioned at least partially under a transmitting surface of the cleaning solution; and    removing the part from the cleaning solution via a transmitting surface of the cleaning solution separate from the receiving surface.    
   
   
       10 . The method of  claim 9 , further comprising: 
 transmitting the part through vapor including one or more drying agents upon removing the part from the cleaning solution.    
   
   
       11 . The method of  claim 9 , wherein substantially cleaning the part in the first region comprises cleaning the part using at least one of ultra- and mega-sonic cleaning techniques.  
   
   
       12 . The method of  claim 9 , wherein substantially cleaning the part in the first region comprises heating at least a portion of the solution in the first region.  
   
   
       13 . The method of  claim 9 , wherein substantially cleaning the part in the first region comprises controlling one or more cleaning techniques based on received information indicative of one or more cleaning parameters.  
   
   
       14 . The method of  claim 13 , wherein the one or more cleaning parameters comprises at least one of a measured contamination amount, and a measured temperature.  
   
   
       15 . A device manufacturing system comprising: 
 a cleaning module, the cleaning module comprising:    a reservoir configured to receive fluid from an input, the reservoir including a first portion and a second portion, wherein the first portion of the reservoir configured to contain fluid at least partially under a receiving surface of the fluid, and wherein the second portion of the reservoir is configured to contain fluid at least partially under a transmitting surface of the fluid separate from the receiving surface of the fluid.    
   
   
       16 . The system of  claim 15 , further comprising a process module, the process module configured to receive one or more substrates from the cleaning module, to transmit one or more substrates to the cleaning module, or both.  
   
   
       17 . The system of  claim 16 , wherein the process module is a semiconductor process module.  
   
   
       18 . The system of  claim 16 , wherein the cleaning module is integrated with the process module.  
   
   
       19 . The system of  claim 15 , further including a controller, the controller configured to receive information indicative of one or more cleaning process parameters from at least one of the cleaning module and the process module.  
   
   
       20 . The system of  claim 19 , wherein the controller is further configured to provide information indicative of one or more control parameters to at least one of the cleaning module and the process module.