US2007039180A1PendingUtilityA1

Method of manufacturing nozzle for inkjet head

Assignee: SAMSUNG ELECTRO MECHPriority: Aug 17, 2005Filed: Aug 9, 2006Published: Feb 22, 2007
Est. expiryAug 17, 2025(expired)· nominal 20-yr term from priority
B41J 2/1623B41J 2/1626B41J 2/162B41J 2/1631B41J 2/1433B41J 2/1643Y10T29/49401
40
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Claims

Abstract

A method of manufacturing a nozzle for an inkjet head is disclosed. With the method of manufacturing a nozzle for an inkjet head, comprising (a) coating photoresist on an inkjet head structure comprising a nozzle part; (b) adjusting exposure conditions and performing exposure and developing on the nozzle part to remove a portion of the photoresist; (c) joining a hydrophobic layer onto the portion of the nozzle part where the photoresist has been removed; and (d) removing the photoresist remaining on the nozzle part, it is easy to control the depth of the hydrophobic layer to be uniform, and the depth to which the hydrophobic layer is deposited may be controlled even when the back surface of the nozzle has a complex shape, so that the uniformity and reproduction of the hydrophobicity-treated nozzles are improved.

Claims

exact text as granted — not AI-modified
1 . A method of manufacturing a nozzle for an inkjet head, the method comprising: 
 (a) coating photoresist on an inkjet head structure comprising a nozzle part;    (b) adjusting exposure conditions and performing exposure and developing on the nozzle part to remove a portion of the photoresist;    (c) joining a hydrophobic layer onto the portion of the nozzle part where the photoresist has been removed; and    (d) removing the photoresist remaining on the nozzle part.    
   
   
       2 . The method of  claim 1 , wherein the head structure further comprises any one or more of a pressure chamber, an ink injection channel, and a manifold.  
   
   
       3 . The method of  claim 1 , wherein the photoresist is a liquid.  
   
   
       4 . The method of  claim 1 , wherein the exposure conditions include exposure time or exposure amount.  
   
   
       5 . The method of  claim 1 , wherein the hydrophobic layer comprises Teflon-based material or parylene.  
   
   
       6 . The method of  claim 1 , wherein the hydrophobic layer is joined by vacuum deposition or by plating.  
   
   
       7 . The method of  claim 1 , wherein the operation (b) further comprises adjusting the exposure conditions so that the photoresist coated on an outer surface of the nozzle part is sensitized.  
   
   
       8 . The method of  claim 1 , wherein the operation (b) further comprises adjusting the exposure conditions so that the photoresist is sensitized up to a predetermined depth of the nozzle.  
   
   
       9 . The method of  claim 8 , wherein the predetermined depth is uniform along the inner perimeter of the nozzle.

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