US2007039147A1PendingUtilityA1

Variable capacitor and method of manufacturing variable capacitor

Assignee: FUJITSU LTDPriority: Jan 31, 2005Filed: Oct 24, 2006Published: Feb 22, 2007
Est. expiryJan 31, 2025(expired)· nominal 20-yr term from priority
H01G 5/16Y10T29/435E03C 1/04E03C 1/021H01G 5/18
46
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

The first movable electrode is flat, but the second movable electrode is deformed into a convex shape. A dielectric layer is placed on the facing surface of the second movable electrode. By adjusting a voltage to be applied between the first movable electrode and the second movable electrode, an arbitrary distance is secured between the two electrodes by the electrostatic attractive force generated between the two electrodes, and a desired electrostatic capacitance is obtained. When the distance between the two electrodes is shortened, first, at the center, a part of the first movable electrode and a part of the second movable electrode come into contact with each other with the dielectric layer between them. Then, the first movable electrode and the dielectric layer (second movable electrode) come into contact with each other successively from the contact part towards the periphery side, and the contact area gradually increases.

Claims

exact text as granted — not AI-modified
1 . A method of manufacturing a variable capacitor whose capacitance is changed by changing a distance between two facing electrodes, comprising the step of stacking an electrode film to be the electrode and a dielectric film having a different stress or thermal expansion coefficient from the electrode film.  
   
   
       2 . A method of manufacturing a variable capacitor whose capacitance is changed by changing a distance between two facing electrodes, comprising the steps of: 
 forming a sacrifice layer on a substrate;    forming a convex resist pattern on the sacrifice layer;    forming an electrode film to be the electrode on the sacrifice layer and the resist pattern; and    removing the sacrifice layer and the resist pattern.

Join the waitlist — get patent alerts

Track US2007039147A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.