Electrolytic processing apparatus

Abstract

An electrolytic processing apparatus is used to remove a metal film formed on a surface of a substrate. The electrolytic processing apparatus includes a feeding electrode 31 for feeding electricity to a metal film 6 on a substrate W, a processing electrode 32 for processing the metal film 6 , a substrate carrier 11 for holding the substrate W, a first supply passage 51 for supplying a first electrolytic processing liquid, a second supply passage 52 for supplying a second electrolytic processing liquid, an insulating member 36 for electrically isolating the first electrolytic processing liquid and the second electrolytic processing liquid, a table 12 on which the feeding electrode 31 , the processing electrode 32 , and the insulating member 36 are disposed, and a relative movement mechanism 17 for making a relative movement between the table 12 and the substrate carrier 11.

1 . An electrolytic processing apparatus comprising: 
 at least one feeding electrode for feeding electricity to a metal film on a substrate;    at least one processing electrode for processing the metal film;    a substrate carrier for holding the substrate in such a state that the metal film faces said feeding electrode and said processing electrode;    a first supply passage for supplying a first electrolytic processing liquid to a gap between said feeding electrode and the substrate;    a second supply passage for supplying a second electrolytic processing liquid to a gap between said processing electrode and the substrate;    an insulating member for electrically isolating the first electrolytic processing liquid and the second electrolytic processing liquid;    a table on which said feeding electrode, said processing electrode, and said insulating member are disposed;    a power supply for applying voltage between said feeding electrode and said processing electrode; and    a relative movement mechanism for making a relative movement between said table and said substrate carrier while said insulating member and the metal film are in contact with each other.    
     
     
         2 . An electrolytic processing apparatus according to  claim 1 , wherein said insulating member is made of a material which does not allow a liquid to pass through said insulating member.  
     
     
         3 . An electrolytic processing apparatus according to  claim 1 , wherein a partition wall is disposed between said feeding electrode and said processing electrode.  
     
     
         4 . An electrolytic processing apparatus according to  claim 1 , wherein a plurality of said feeding electrodes and a plurality of said processing electrodes are arranged alternately.  
     
     
         5 . An electrolytic processing apparatus according to  claim 1 , wherein said feeding electrode has a surface having a plurality of openings through which the first electrolytic processing liquid is supplied to the metal film, and said processing electrode has a surface having a plurality of openings through which the second electrolytic processing liquid is supplied to the metal film.  
     
     
         6 . An electrolytic processing apparatus according to  claim 5 , wherein a plurality of weirs for retaining the first electrolytic processing liquid are provided respectively around said plurality of openings of said feeding electrode, and a plurality of weirs for retaining the second electrolytic processing liquid are provided respectively around said plurality of openings of said processing electrode.  
     
     
         7 . An electrolytic processing apparatus according to  claim 1 , wherein said insulating member is a single piece disposed so as to cover said feeding electrode and said processing electrode, and said insulating member has through-holes through which said first and second electrolytic processing liquids are supplied to the metal film.  
     
     
         8 . An electrolytic processing apparatus according to  claim 1 , wherein said insulating member comprises an elastic pad for forming a contact surface with the substrate.  
     
     
         9 . An electrolytic processing apparatus according to  claim 1 , wherein said insulating member comprises a fixed abrasive pad.  
     
     
         10 . An electrolytic processing apparatus according to  claim 8 , wherein said elastic pad is a resin pad having a sawtooth cross section.  
     
     
         11 . An electrolytic processing apparatus according to  claim 1 , wherein an elastic member is disposed between said table and said insulating member.  
     
     
         12 . An electrolytic processing apparatus according to  claim 1 , wherein said table has reservoirs for storing the first electrolytic processing liquid and the second electrolytic processing liquid which have been supplied from said first supply passage and said second supply passage.  
     
     
         13 . An electrolytic processing apparatus according to  claim 1 , further comprising: 
 a first discharge passage for recovering the first electrolytic processing liquid supplied from said first supply passage;    a second discharge passage for recovering the second electrolytic processing liquid supplied from said second supply passage;    a first storing tank connected to said first supply passage and said first discharge passage, the first electrolytic processing liquid being stored in said first storing tank; and    a second storing tank connected to said second supply passage and said second discharge passage, the second electrolytic processing liquid being stored in said second storing tank.    
     
     
         14 . An electrolytic processing apparatus according to  claim 1 , wherein main components contained respectively in the first electrolytic processing liquid and the second electrolytic processing liquid are the same as each other.  
     
     
         15 . An electrolytic processing apparatus according to  claim 14 , wherein concentrations of the main components contained respectively in the first electrolytic processing liquid and the second electrolytic processing liquid are the same as each other at a time of starting an electrolytic processing.  
     
     
         16 . An electrolytic processing apparatus according to  claim 1 , wherein said relative movement mechanism includes at least one of a rotating mechanism for rotating said substrate carrier, a swinging mechanism for swinging said substrate carrier, and a translating mechanism for translating said substrate carrier.  
     
     
         17 . An electrolytic processing apparatus according to  claim 1 , wherein said relative movement mechanism includes a scrolling mechanism by which said table performs a scrolling motion.  
     
     
         18 . An electrolytic processing apparatus according to  claim 4 , further comprising a plurality of distance adjusting mechanisms each for adjusting a distance between each of said plurality of said processing electrodes and the substrate.  
     
     
         19 . An electrolytic processing apparatus according to  claim 1 , wherein said processing electrode is divided into a plurality of electrode parts aligned in a longitudinal direction of said processing electrode.  
     
     
         20 . An electrolytic processing apparatus according to  claim 19 , further comprising a controller for controlling a distribution of currents to be supplied to said plurality of said processing electrodes.  
     
     
         21 . An electrolytic processing apparatus according to  claim 1 , further comprising a vertical-movement mechanism for moving said substrate carrier vertically.  
     
     
         22 . A substrate processing system comprising: 
 an electrolytic processing unit for electrolytically processing a substrate having a metal film on a surface thereof;    a CMP unit for polishing the substrate; and    a transfer unit for transferring the substrate between at least said electrolytic processing unit and said CMP unit;    wherein said electrolytic processing unit comprises:    at least one feeding electrode for feeding electricity to the metal film on the substrate;    at least one processing electrode for processing the metal film;    a substrate carrier for holding the substrate in such a state that the metal film faces said feeding electrode and said processing electrode;    a first supply passage for supplying a first electrolytic processing liquid to a gap between said feeding electrode and the substrate;    a second supply passage for supplying a second electrolytic processing liquid to a gap between said processing electrode and the substrate;    an insulating member for electrically isolating the first electrolytic processing liquid and the second electrolytic processing liquid;    a table on which said feeding electrode, said processing electrode, and said insulating member are disposed;    a power supply for applying voltage between said feeding electrode and said processing electrode; and    a relative movement mechanism for making a relative movement between said table and said substrate carrier while said insulating member and the metal film are in contact with each other.    
     
     
         23 . A substrate processing system according to  claim 22 , further comprising a cleaning unit for cleaning the substrate.  
     
     
         24 . A substrate processing system according to  claim 22 , further comprising a film-thickness measuring unit for measuring a thickness of the metal film on the substrate.  
     
     
         25 . A substrate processing system according to  claim 22 , further comprising a conditioning unit for conditioning said insulating member.