Heat dissipation device

Abstract

A heat dissipation device includes a first assembly having a first shell portion and a wick layer formed thereon, a second assembly having a second shell portion and a clapboard formed thereon, and a circumfluence cavity and an evaporation cavity formed by coupling the first assembly and the second assembly together and separated by the clapboard. The circumfluence cavity and the evaporation cavity are communicated via the wick layer.

1 . A heat dissipation device comprising: 
 a first assembly comprising a first shell portion and a wick layer formed thereon;    a second assembly comprising a second shell portion and a clapboard formed thereon; and    a circumfluence cavity and an evaporation cavity being formed by coupling the first assembly and the second assembly together and separated from each other by the clapboard;    wherein, the circumfluence cavity and the evaporation cavity are communicated via the wick layer of the first assembly.    
     
     
         2 . The heat dissipation device in accordance with  claim 1 , wherein the circumfluence cavity and the evaporation cavity each having a through hole defined in one of the shell portions.  
     
     
         3 . The heat dissipation device in accordance with  claim 1 , wherein a top surface of the wick layer is coplanar with a top surface of the clapboard.  
     
     
         4 . The heat dissipation device in accordance with  claim 1 , wherein the second shell portion comprises a flat portion in accordance with the first shell portion, and a side wall portion extending from the edge of the flat portion perpendicularly.  
     
     
         5 . The heat dissipation device in accordance with  claim 4 , wherein the second assembly further comprises a plurality of guiding pieces extending from the second shell portion.  
     
     
         6 . The heat dissipation device in accordance with  claim 5 , wherein the guiding pieces form top surfaces coplanar with a top surface of the clapboard.  
     
     
         7 . The heat dissipation device in accordance with  claim 5 , wherein the guiding pieces are substantially parallel to each other and orthogonal to the clapboard.  
     
     
         8 . The heat dissipation device in accordance with  claim 5 , wherein one end of each guiding pieces is coupled to the clapboard.  
     
     
         9 . The heat dissipation device in accordance with  claim 5 , wherein the second shell portion, the clapboard, and the guiding pieces are integrally formed.  
     
     
         10 . The heat dissipation device in accordance with  claim 5 , wherein the evaporation cavity comprises a gas collecting chamber and a plurality of guiding channels defined by the guiding pieces with the second shell portion.  
     
     
         11 . The heat dissipation device in accordance with  claim 10 , wherein the gas collecting chamber is an arc-shaped gas collecting chamber.  
     
     
         12 . The heat dissipation device in accordance with  claim 1 , wherein the first shell portion and the second assembly are made from material selected from the group comprising of copper, aluminum, iron, and any alloy thereof.  
     
     
         13 . The heat dissipation device in accordance with  claim 1 , wherein the wick layer is made from a sintered layer.  
     
     
         14 . The heat dissipation device in accordance with  claim 13 , wherein the sintered layer is sintered with material selected from the group comprising of copper powder, aluminum powder, and iron powder.  
     
     
         15 . The heat dissipation device in accordance with  claim 1 , wherein the wick layer is made from a carbon nanotube layer.  
     
     
         16 . The heat dissipation device in accordance with  claim 1 , wherein the first assembly and second assembly are coupled together by jointing.  
     
     
         17 . The heat dissipation device in accordance with  claim 1 , wherein the first assembly and second assembly are coupled together by sticking.  
     
     
         18 . A heat dissipation device comprising: 
 a first assembly comprising a first shell portion and a wick layer formed thereon;    a second assembly comprising a second shell portion and a clapboard formed thereon; and    a cavity having a circumfluence portion and an evaporation portion formed by coupling the first assembly and the second assembly together;    wherein, the circumfluence portion and the evaporation portion are separated by the clapboard of the second assembly and communicated with each other via the wick layer of the first assembly, each of the circumfluence portion and the evaporation portion having a through hole defined in one of the shell portions of the first assembly and the second assembly.