Plasma source assembly and method of manufacture

Abstract

A plasma source assembly including an outer shield, a dielectric chamber wall, and a helical coil provided between the outer shield and the dielectric chamber wall. The plasma source assembly also includes a coil support assembly configured to facilitate repeatable performance of the helical coil. Preferably, the assembly includes a plenum cooling plate that is configured to supply cooling fluid to a first cooling rod provided within a resonator cavity defined by the chamber wall and the outer shield, and receive cooling fluid from a second cooling rod provided within the resonator cavity. The assembly preferably also includes a spacer provided between the first cooling rod and the second cooling rod, and coil insulators having holes configured to receive the helical coil.

1 . A plasma processing system comprising: 
 a process chamber;    a chuck assembly provided within said process chamber;    a gas inject assembly provided opposite said chuck assembly; and    a plasma source assembly comprising a dielectric chamber wall, a helical coil, and an outer shield mounting said gas inject assembly to said process chamber, said outer shield comprising a plurality of plates.    
     
     
         2 . The plasma processing system according to  claim 1 , further comprising at least one sealing member provided between adjacent plates of said plurality of plates.  
     
     
         3 . The plasma processing system according to  claim 1 , further comprising means for stacking and detachably joining said plurality of plates.  
     
     
         4 . The plasma processing system according to  claim 1 , further comprising: 
 said dielectric chamber wall and said plurality of plates defining a resonator cavity; and    a helical coil provided within said resonator cavity.    
     
     
         5 . The plasma processing system according to  claim 1 , further comprising means for tuning said helical coil to a predetermined frequency.  
     
     
         6 . The plasma processing system according to  claim 4 , further comprising: 
 means for circulating cooling fluid throughout the plasma processing system; and    a plenum cooling plate defining a manifold configured to supply cooling fluid to said means for circulating.    
     
     
         7 . The plasma processing system according to  claim 6 , wherein said gas inject assembly is provided between said dielectric chamber wall and said plenum cooling plate.  
     
     
         8 . The plasma processing system according to  claim 6 , further comprising means for removing bubbles from the cooling fluid.  
     
     
         9 . The plasma processing system according to  claim 6 , wherein said plenum cooling plate is configured to supply cooling fluid to a first cooling rod provided within said resonator cavity.  
     
     
         10 . The plasma processing system according to  claim 9 , wherein: 
 said first cooling rod is provided radially outside said helical coil; and    said first cooling rod has at least one outlet hole configured to discharge the cooling fluid in a circumferential direction within said resonator cavity.    
     
     
         11 . The plasma processing system according to  claim 9 , wherein: 
 said plenum cooling plate is configured to receive cooling fluid from a second cooling rod provided within said resonator cavity;    said second cooling rod is provided radially inside said helical coil; and    said second cooling rod has at least one inlet hole configured to receive the cooling fluid from within said resonator cavity.    
     
     
         12 . The plasma processing system according to  claim 11 , further comprising: 
 a spacer provided between said first cooling rod and said second cooling rod; and    coil insulators having holes configured to receive said helical coil.