Wafer processing apparatus and wafer processing method using the same

Abstract

A wafer processing apparatus and a wafer processing method using the same are provided. A grinding wheel may include a wheel body having a plurality of wheel blades to remove a backside of a wafer, each of the plurality of wheel blades in an annular array with respect to each other and configured to move individually. A method of processing a wafer may include preparing a wafer for a backside processing, a first processing the backside of the wafer using a first wheel blade or a second wheel blade, and a second processing the backside of the wafer using only the second wheel blade.

1 . A grinding wheel comprising a wheel body having a plurality of wheel blades to remove a backside of a wafer, each of the plurality of wheel blades in an annular array with respect to each other and configured to move individually.  
   
   
       2 . The grinding wheel according to  claim 1 , wherein the plurality of wheel blades includes diamond materials.  
   
   
       3 . The grinding wheel according to  claim 1 , wherein each of the plurality wheel blades have different grit sizes.  
   
   
       4 . The grinding wheel according to  claim 1 , wherein the plurality of wheel blades are concentric with respect to each other.  
   
   
       5 . The grinding wheel according to  claim 1 , wherein the plurality of wheel blades includes a first wheel blade including diamond materials and a second wheel blade including nonwoven materials.  
   
   
       6 . The grinding wheel according to  claim 5 , wherein the second wheel blade is configured in an inner circumference of the first wheel blade.  
   
   
       7 . A wafer processing apparatus comprising: 
 a grinding wheel including a wheel body having a plurality of wheel blades to remove a backside of a wafer, each of the plurality of wheel blades in an annular array with respect to each other and configured to move individually;    a processing head configured to detachably hold the wheel body; and    a wafer chuck configured to hold the wafer during removal of the backside of the wafer.    
   
   
       8 . The wafer processing apparatus according to  claim 7 , further comprising a wheel moving unit, including: 
 a connecting shaft configured to engage at least one of the plurality of wheel blades;    a bearing at one end of the connecting shaft;    a cam contacting the bearing and configured to enable movement of the connecting shaft and to reciprocate in a vertical direction of the connecting shaft by a desired distance;    a rotating shaft connected to the cam; and    a rotary motor configured to rotate the rotating shaft, to reciprocate the cam and simultaneously reciprocate the rotating shaft by a desired distance.    
   
   
       9 . The wafer processing apparatus according to  claim 8 , wherein the wheel moving unit further includes a distance sensor disposed on the rotary motor configured to sense a moving distance of the cam.  
   
   
       10 . The wafer processing apparatus according to  claim 8 , wherein the wheel moving unit further includes a resilient member adapted to return the connecting shaft moved by the cam to an original position.  
   
   
       11 . The wafer processing apparatus according to  claim 7 , wherein the wheel moving unit includes: 
 a piston rod configured to engage at least one of the plurality of wheel blades; and    a cylinder connected to the piston rod and configured to move the piston rod by a desired distance.    
   
   
       12 . A method of processing a wafer, comprising: 
 preparing a wafer for a backside processing;    primarily processing the backside of the wafer using a first wheel blade or a second wheel blade; and    secondarily processing the backside of the wafer using only the second wheel blade.    
   
   
       13 . The method according to  claim 12 , wherein the primarily processing and the secondarily processing each include grinding the wafer.  
   
   
       14 . The method according to  claim 12 , wherein the primarily processing uses only the first wheel blade.  
   
   
       15 . The method according to  claim 14 , wherein the primarily processing and the secondarily processing each include grinding the wafer.  
   
   
       16 . The method according to  claim 14 , wherein the primarily processing includes grinding the wafer and the secondarily processing includes polishing the wafer.  
   
   
       17 . The method according to  claim 12 , wherein the first wheel blade and the second wheel blade include diamond materials.  
   
   
       18 . The method according to  claim 17 , wherein the first wheel blade and the second wheel blade have different grit sizes.  
   
   
       19 . The method according to  claim 17 , wherein the second wheel blade has a grit size smaller than a grit size of the first wheel blade.  
   
   
       20 . The method according to  claim 16 , wherein the first wheel blade includes diamond materials and the second wheel blade includes unwoven materials.