Polishing apparatus

Abstract

The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer to form a flat surface thereon. The polishing apparatus includes a polishing table ( 20 ), a polishing tool ( 1 ) attached to an upper surface of the polishing table ( 20 ), and a fluid passage ( 40 ) having openings on the upper surface of the polishing table ( 20 ). The apparatus is operable to bring a workpiece (W) into sliding contact with the polishing tool ( 1 ) to polish the workpiece while supplying a polishing liquid onto the polishing tool ( 1 ). The polishing tool ( 1 ) is fixed to the polishing table ( 20 ) by a vacuum produced in the fluid passage ( 40 ).

1 . A polishing apparatus comprising: 
 a polishing table;    a polishing tool attached to an upper surface of said polishing table, said polishing apparatus being operable to bring a workpiece into sliding contact with said polishing tool to polish the workpiece while supplying a polishing liquid onto said polishing tool; and    a fluid passage having openings on the upper surface of said polishing table,    wherein said polishing tool is fixed to said polishing table by a vacuum produced in said fluid passage.    
     
     
         2 . The polishing apparatus according to  claim 1 , wherein: 
 said polishing tool comprises a polishing pad and a base on which said polishing pad is placed; and    said polishing tool is divided into a plurality of segments.    
     
     
         3 . The polishing apparatus according to  claim 2 , wherein said base is made of resin or metal.  
     
     
         4 . The polishing apparatus according to  claim 2 , wherein said polishing pad and said base are made of the same material.  
     
     
         5 . The polishing apparatus according to  claim 1 , further comprising a gas-liquid separator for separating the polishing liquid and a gas from each other, said gas-liquid separator being disposed between said fluid passage and a vacuum source for producing the vacuum in said fluid passage.  
     
     
         6 . The polishing apparatus according to  claim 1 , further comprising a plurality of polishing liquid supply ports for supplying plural kinds of polishing liquids.  
     
     
         7 . The polishing apparatus according to  claim 1 , wherein: 
 said polishing tool comprises a first polishing tool for a first polishing process, and a second polishing tool for a second polishing process; and    said polishing apparatus further comprises a storage bath for storing said first polishing tool while performing the second polishing process.    
     
     
         8 . The polishing apparatus according to  claim 7 , further comprising: 
 a first polishing liquid supply nozzle for supplying a first polishing liquid during the first polishing process; and    a second polishing liquid supply nozzle for supplying a second polishing liquid during the second polishing process.    
     
     
         9 . The polishing apparatus according to  claim 2 , further comprising a gas-liquid separator for separating the polishing liquid and a gas from each other, said gas-liquid separator being disposed between said fluid passage and a vacuum source for producing the vacuum in said fluid passage.  
     
     
         10 . The polishing apparatus according to  claim 3 , further comprising a gas-liquid separator for separating the polishing liquid and a gas from each other, said gas-liquid separator being disposed between said fluid passage and a vacuum source for producing the vacuum in said fluid passage.  
     
     
         11 . The polishing apparatus according to  claim 4 , further comprising a gas-liquid separator for separating the polishing liquid and a gas from each other, said gas-liquid separator being disposed between said fluid passage and a vacuum source for producing the vacuum in said fluid passage.  
     
     
         12 . The polishing apparatus according to  claim 2 , further comprising a plurality of polishing liquid supply ports for supplying plural kinds of polishing liquids.  
     
     
         13 . The polishing apparatus according to  claim 3 , further comprising a plurality of polishing liquid supply ports for supplying plural kinds of polishing liquids.  
     
     
         14 . The polishing apparatus according to  claim 4 , further comprising a plurality of polishing liquid supply ports for supplying plural kinds of polishing liquids.  
     
     
         15 . The polishing apparatus according to  claim 5 , further comprising a plurality of polishing liquid supply ports for supplying plural kinds of polishing liquids.  
     
     
         16 . The polishing apparatus according to  claim 9 , further comprising a plurality of polishing liquid supply ports for supplying plural kinds of polishing liquids.  
     
     
         17 . The polishing apparatus according to  claim 10 , further comprising a plurality of polishing liquid supply ports for supplying plural kinds of polishing liquids.  
     
     
         18 . The polishing apparatus according to  claim 11 , further comprising a plurality of polishing liquid supply ports for supplying plural kinds of polishing liquids.