Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods

Abstract

Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods are disclosed. A method in accordance with one embodiment of the invention includes disposing a polishing liquid on a polishing surface of a microfeature workpiece polishing pad. The polishing pad can include a matrix material and a plurality of abrasive elements fixedly distributed in the matrix material. The polishing liquid can include a plurality of particles that are at least approximately chemically inert with respect to the abrasive elements. In a particular embodiment, the particles can have a polymeric, non-ceramic composition. The method can further include moving at least one of the polishing pad and the plurality of particles relative to the other to remove deposits from the polishing pad. This operation can be performed serially or simultaneously with using the polishing pad to remove material from a microfeature workpiece.

1 - 49 . (canceled)  
   
   
       50 . A polishing medium for removing material from a microfeature workpiece, comprising: 
 a polishing pad that includes: 
 a matrix material; and  
 a plurality of abrasive elements fixedly dispersed in the matrix material; and  
   a polishing liquid adjacent to the polishing pad, the polishing liquid including: 
 de-ionized water; and  
 a plurality of particles in the de-ionized water, the particles being generally chemically inert with respect to the abrasive elements.  
   
   
   
       51 . The polishing medium of  claim 50  wherein the particles are formed from at least one of polymethylmethacrylate, polystyrene, polyvinyl alcohol, polyethylene, polycarbonate, polyester, and polyurethane.  
   
   
       52 . The polishing medium of  claim 50  wherein the particles have a polymeric, non-ceramic composition.  
   
   
       53 . The polishing medium of  claim 50  wherein the particles have a generally spherical shape.  
   
   
       54 . The polishing medium of  claim 50  wherein the abrasive elements have a first hardness and the particles have a second hardness less than the first hardness.  
   
   
       55 . The polishing medium of  claim 50  wherein the particles have a size in the range of from about 20 nanometers to about five hundred microns.  
   
   
       56 . The polishing medium of  claim 50  wherein the particles have a concentration in the polishing liquid of rom about 20 ppm to about 5%.  
   
   
       57 . The polishing medium of  claim 50  wherein the polishing liquid is acidic.  
   
   
       58 . The polishing medium of  claim 50  wherein the polishing liquid is alkaline.  
   
   
       59 . The polishing medium of  claim 50  wherein the polishing liquid includes at least one of a surfactant and a dispersant.  
   
   
       60 . The polishing medium of  claim 50  wherein the particles have a polymeric, non-ceramic composition, a generally spherical shape, an average diameter in the range of from about 20 nanometers to about five hundred microns, and a concentration in the polishing liquid of from about 20 ppm to about 5%.