US2007029547A1PendingUtilityA1

Process for forming organic layers, organic electronic devices,and transistors

Individually held — no corporate assignee on recordPriority: Apr 22, 2004Filed: Apr 28, 2006Published: Feb 8, 2007
Est. expiryApr 22, 2024(expired)· nominal 20-yr term from priority
Inventors:Ian Parker
H10K 50/11H10K 85/1135H10K 85/115H10K 71/12H10K 71/60H10K 71/13H10K 10/462
50
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Claims

Abstract

Organic electronic devices are fabricated by a process includes forming an organic layer including: placing a first liquid composition over a first portion of a surface of a substrate without a well structure connected to or adjacent the first portion of the surface of the substrate, i) the first portion of the surface of the substrate has a first surface energy, ii) the first liquid composition includes a first liquid medium and iii) the first liquid composition has a second surface energy that is higher than the first surface energy; and evaporating the first liquid medium while the first liquid composition overlies the first portion of the surface of the substrate.

Claims

exact text as granted — not AI-modified
1 . A process of forming an organic layer comprising: 
 placing a first liquid composition over a first portion of a surface of a substrate without a well structure connected to or adjacent the first portion of the surface of the substrate, wherein i) the first portion of the surface of the substrate has a first surface energy, ii) the first liquid composition includes a first liquid medium and iii) the first liquid composition has a second surface energy that is higher than the first surface energy; and    evaporating the first liquid medium while the first liquid composition overlies the first portion of the surface of the substrate.    
     
     
         2 . The process of  claim 1 , further comprising providing a surfactant over the first portion of the surface of the substrate before placing the first liquid composition over the first portion of the surface of the substrate.  
     
     
         3 . The process of  claim 2 , wherein the surfactant includes a fluorine-containing material.  
     
     
         4 . The process of  claim 2 , wherein providing the surfactant includes exposing the first portion of the surface of the substrate to a fluorine-containing fluid before placing the first liquid composition over the first portion of the surface of the substrate.  
     
     
         5 . The process of  claim 1 , wherein the first liquid composition includes an organic active material.  
     
     
         6 . The process of  claim 5 , wherein the organic active material emits or responds to radiation.  
     
     
         7 . The process of  claim 5 , wherein the organic active material filters radiation.  
     
     
         8 . The process of  claim 5 , wherein the organic active material is part of a transistor.  
     
     
         9 . The process of  claim 1 , wherein placing the first liquid composition over the first portion of the surface of the substrate includes using an ink-jet deposition technique.  
     
     
         10 . The process of  claim 1 , further comprising 
 placing a second liquid composition over a second portion of the surface of the substrate without the well structure connected to or adjacent the second portion surface of the substrate, wherein i) the second portion does not overlap the first portion, ii) the second portion of the surface of the substrate has a third surface energy, iii) the second liquid composition includes a second liquid medium, iv) the second liquid

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