Wafer cassette used in high temperature baking process

Abstract

A wafer cassette for consolidation in process of high temperature baking is provided. The wafer cassette includes one front end member, two sidewall plates, one back end member, a plurality of fixture slots, two resilient sheets and two supporting rods. By using this wafer cassette in high temperature baking process, the chance of having the wafer damage is minimized.

1 . A wafer cassette used in high temperature baking process, comprising: 
 a front end member;    two sidewall plates oppositely disposed at two ends of said front end member;    a back end member disposed between said two sidewall plates; and    two resilient sheets with curved portion oppositely disposed at the bottom of said two sidewall plates.    
   
   
       2 . The wafer cassette of  claim 1 , wherein each of said sidewall plates has a plurality of vertical slots and an horizontal supporting rod.  
   
   
       3 . The wafer cassette of  claim 1 , wherein said resilient sheet is disposed at the bottom of said sidewall plate.  
   
   
       4 . The wafer cassette of  claim 1 , wherein said resilient sheet is connected to said supporting rod.  
   
   
       5 . The wafer cassette of  claim 1 , wherein said sidewall plate includes a plurality of fixture slots.  
   
   
       6 . The wafer cassette of  claim 5 , wherein said fixture slot is used to dispose the wafer.  
   
   
       7 . The wafer cassette of  claim 1 , wherein said resilient sheets is made of metal.  
   
   
       8 . The wafer cassette of  claim 7 , wherein said resilient sheets can stand heat up to three hundred centigrade degrees.  
   
   
       9 . The wafer cassette of  claim 1 , wherein said resilient sheets has a ramp to increase the contact area in the wafer.