US2007023895A1PendingUtilityA1
Semiconductor device having capacitors for reducing power source noise
Est. expiryDec 15, 2020(expired)· nominal 20-yr term from priority
Y10S257/924H10W 72/552H10W 74/00H10W 90/297H10W 72/834H10W 72/01H10W 72/884H10W 90/754H10W 72/877H10W 74/15H10W 72/942H10W 72/29H10W 72/922H10W 90/00H10W 90/724H10W 90/722H10W 72/244H10W 90/734H10W 90/732H10W 90/736H10W 44/20H10W 42/20H10W 70/65H10W 72/00H10W 90/701H10W 20/20H10W 40/10H10W 74/117H10W 72/90
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Claims
Abstract
A semiconductor device comprises a BGA substrate having one principal plane furnished with a large number of solder balls, the solder balls constituting a ball grid array; a semiconductor chip mounted on another principal plane of the BGA substrate, the semiconductor chip being electrically connected to the BGA substrate by metal wires; and chip capacitors mounted on the semiconductor chip to reduce power source noise.
Claims
exact text as granted — not AI-modified1 .- 15 . (canceled)
16 . A semiconductor device comprising:
a substrate having one principal plane furnished with solder balls; a semiconductor chip mounted on another principal plane of the substrate, the semiconductor chip being electrically connected to the substrate by metal wires; chip capacitors mounted on the semiconductor chip; and a shield plane connected to ground potential and incorporated in the substrate.Join the waitlist — get patent alerts
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