Method of manufacturing wiring board, and liquid ejection head having wiring board

Abstract

The method of manufacturing a wiring board comprises the steps of: forming a flow channel by covering a groove formed in a resin substrate by means of a covering member; and filling a liquid containing conductive metal into the flow channel, and depositing the conductive metal onto wall faces of the flow channel.

1 . A method of manufacturing a wiring board, comprising the steps of: 
 forming a flow channel by covering a groove formed in a resin substrate by means of a covering member; and    filling a liquid containing conductive metal into the flow channel, and depositing the conductive metal onto wall faces of the flow channel.    
     
     
         2 . The method as defined in  claim 1 , wherein the resin substrate is formed by resin molding by filling a resin material into a mold and curing the resin material.  
     
     
         3 . The method as defined in  claim 1 , wherein: 
 the liquid containing conductive metal is a material which, when making contact with an electroless plating liquid, induces electroless precipitation of the metal that is to be deposited; and    the method further comprises the step of forming an electroless plating layer by using the metal having been deposited on the flow channel as an origin.    
     
     
         4 . The method as defined in  claim 3 , further comprising the step of forming an electrolytic plating layer by using the electroless plating layer as a seed layer.  
     
     
         5 . The method as defined in  claim 1 , wherein the liquid containing conductive metal is a conductive paste.  
     
     
         6 . The method as defined in  claim 1 , wherein: 
 the resin substrate is made of an epoxy resin; and    the method further comprises the steps of:    introducing an ion exchange group into the wall faces of the flow channel by causing liquid containing an oxyacid of sulfur to flow into the flow channel; and    then causing a liquid containing copper ions and a reducing agent to make contact with the groove in the resin substrate.    
     
     
         7 . The method as defined in  claim 1 , wherein: 
 the resin substrate is made of polyimide resin; and    the method further comprises the steps of:    introducing an ion exchange group into the wall faces of the flow channel by causing liquid containing an aqueous alkali solution to flow into the flow channel; and    then causing a liquid containing copper ions and a reducing agent to make contact with the groove in the resin substrate.    
     
     
         8 . The method as defined in  claim 1 , further comprising the steps of: 
 forming the groove formed in the resin substrate in a shape whereby a plurality of desired conducting layers are connected together;    forming the conducting layers by means of a same operation; and    then dividing the conducting layers by cutting.    
     
     
         9 . The method as defined in  claim 1 , further comprising the steps of: 
 forming grooves in both surfaces of the resin substrate;    forming a through hole which connects the grooves in the surfaces; and    forming flow channels by covering the grooves in the surfaces.    
     
     
         10 . A liquid ejection head, comprising: 
 a plurality of pressure chambers which are connected respectively to a plurality of nozzles ejecting liquid and are arranged in a two-dimensional configuration;    a diaphragm which constitutes wall faces of the pressure chambers on a side of the pressure chambers reverse to a side adjacent to the nozzles;    an ejection device structure formed by a plurality of piezoelectric elements which respectively deform the pressure chambers and are disposed respectively at positions corresponding to the pressure chambers on a surface of the diaphragm reverse to a surface adjacent to the pressure chambers; and    a substrate on which electrical wires for electrically connecting a drive circuit for driving the piezoelectric elements with drive electrodes of the piezoelectric elements are arranged, conducting layers to be the electrical wires being formed by the method as defined in  claim 1.